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Coolaboratory Liquid Pro/Ultra question - Page 2

post #11 of 14
Pk1 thermal conductance is 8 w/mk

clp/clu has heat conductance over 4x that of PK1 at 32 w/mk.

When testing between IHS and cooling block, surface area is much larger than die to IHS, so will minimize the difference one sees in tim. Also tim2 (ihs to block) is much farther from heat source, again will minimize differences.

But between die and IHS, clp/clu will be several degrees C better some have seen up to 10C at high volts, ie higher tdp, higher difference, and liquid metal will resist pump out better, ie less chance of having to reapply over time.

Not to say there arent other pastes that will work well on die, but clp/clu will give better temps, and more resistant to pump out, which is why most often recommended.

But glad others are testing different tims, so can see how they work over long haul as well.
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post #12 of 14
Upon further inspection you are correct. Looking at the delid spreadsheet it's clear clu or clp is significantly better. Will be ordering some
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post #13 of 14
Quote:
Originally Posted by Dimaggio1103 View Post

Upon further inspection you are correct. Looking at the delid spreadsheet it's clear clu or clp is significantly better. Will be ordering some

meaningless comment from me here but I have to laugh at the with "HT on" in your sig, thank you I needed a good laugh the way my day has been going.
post #14 of 14
Quote:
Originally Posted by enigma7820 View Post

meaningless comment from me here but I have to laugh at the with "HT on" in your sig, thank you I needed a good laugh the way my day has been going.

Some disable HT so I like to show off.

1.35v for 4.8GHz.......you have my condolences. redface.gif
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