Overclock.net › Forums › Cooling › Cooling Experiments › Tin TIM
New Posts  All Forums:Forum Nav:

Tin TIM

post #1 of 14
Thread Starter 
So I was just theory crafting, is it possible to use molten tin to bind a heatsink to the IHS of a CPU. I'm mostly concerned if the tin will be able to bind correctly to the aluminum IHS and copper/aluminum heatsink, without killing the CPU and if sufficient contact between the two materials will be made. Concerns below.

1. Will the CPU survive the brief exposure to the high temperature? I'm thinking yes.
2. Will this trap air between the surfaces?
3. Will the surfaces bond together correctly, with good contact?
4. Could it be done thin enough to provide net benefit?

So does anyone know if this has been tried before(I couldn't find any results on google). Also how plausible do you guys think this is.

Thoughts?
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
post #2 of 14
The ihs isn't aluminum, it's copper
ivybeech
(21 items)
 
4K-HTPC
(12 items)
 
 
CPUMotherboardGraphicsRAM
Intel i7 6700k@4.7ghz Gigabyte z170xp-sli Nvidia GTX 1080Ti 16gb Team Xtreem DDR4 @16/18/18/37 3333mhz 
Hard DriveHard DriveHard DriveHard Drive
256gb M4 SSD boot 4TB Seagate - Raid 0 4TB Seagate - Raid 0 2TB Western Digital Green for storage 
Hard DriveHard DriveHard DriveHard Drive
5TB Seagate 3 tb Seagate  2TB Seagate 4TB of various external storage 
CoolingOSMonitorMonitor
Corsair H100 in push/pull Windows 10 pro ASUS ROG Swift PG278Q 27" OC Catleap Q270SE IPS 2560x1440@120hz 
KeyboardPowerCaseMouse
Xarmor mechanical cherry mx-brown Hale90 1000w 80+gold EVGA DG-87 Logitech G502 
CPUMotherboardGraphicsRAM
Intel i5-2400 Intel DP67BG Nvidia GTX 950 8gb Gskill Ripjaws 1600mhz ddr3 
Hard DriveOptical DriveCoolingOS
256gb samsung SSD Asus Blu-ray Drive Model BC-12B1ST/BLK/B/AS Corsair H50 push/pull Windows 7 Professional 
MonitorPowerCase
Vizio m60-c3 - 3840x2160 OCZ ZT 750w Silverstone Grandia gd-05 
  hide details  
Reply
ivybeech
(21 items)
 
4K-HTPC
(12 items)
 
 
CPUMotherboardGraphicsRAM
Intel i7 6700k@4.7ghz Gigabyte z170xp-sli Nvidia GTX 1080Ti 16gb Team Xtreem DDR4 @16/18/18/37 3333mhz 
Hard DriveHard DriveHard DriveHard Drive
256gb M4 SSD boot 4TB Seagate - Raid 0 4TB Seagate - Raid 0 2TB Western Digital Green for storage 
Hard DriveHard DriveHard DriveHard Drive
5TB Seagate 3 tb Seagate  2TB Seagate 4TB of various external storage 
CoolingOSMonitorMonitor
Corsair H100 in push/pull Windows 10 pro ASUS ROG Swift PG278Q 27" OC Catleap Q270SE IPS 2560x1440@120hz 
KeyboardPowerCaseMouse
Xarmor mechanical cherry mx-brown Hale90 1000w 80+gold EVGA DG-87 Logitech G502 
CPUMotherboardGraphicsRAM
Intel i5-2400 Intel DP67BG Nvidia GTX 950 8gb Gskill Ripjaws 1600mhz ddr3 
Hard DriveOptical DriveCoolingOS
256gb samsung SSD Asus Blu-ray Drive Model BC-12B1ST/BLK/B/AS Corsair H50 push/pull Windows 7 Professional 
MonitorPowerCase
Vizio m60-c3 - 3840x2160 OCZ ZT 750w Silverstone Grandia gd-05 
  hide details  
Reply
post #3 of 14
Quote:
Originally Posted by Alanim View Post

So I was just theory crafting, is it possible to use molten tin to bind a heatsink to the IHS of a CPU. I'm mostly concerned if the tin will be able to bind correctly to the aluminum IHS and copper/aluminum heatsink, without killing the CPU and if sufficient contact between the two materials will be made. Concerns below.

1. Will the CPU survive the brief exposure to the high temperature? I'm thinking yes.
2. Will this trap air between the surfaces?
3. Will the surfaces bond together correctly, with good contact?
4. Could it be done thin enough to provide net benefit?

So does anyone know if this has been tried before(I couldn't find any results on google). Also how plausible do you guys think this is.

Thoughts?

Tin is one of several metals used to make alloys that can be used to make solder. So technically tin has been used in-between the IHS and CPU die for several generations, just not in a 100% concentration to my knowledge.
Edited by Mattb2e - 6/2/13 at 9:22pm
post #4 of 14
Thread Starter 
Quote:
Originally Posted by Mattb2e View Post

Tin is one of several metals used to make alloys that can be used to make solder. So technically tin has been used in-between the IHS and CPU die for several generations, just not in a 100% concentration to my knowledge.

Well doing it with 100% tin would be the easiest way for someone to attempt this, I assume.

You could do it with a alloy such as tin-silver-copper as well, but that'd be a bit more expensive and harder to make/obtain.

Also, I've heard the IHS is made of copper, it's just easy to forget due to the color of it. Nickle plating I assume?
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
post #5 of 14
Thread Starter 
*edit* double post, cannot wait for my new mouse on wednesday >.>
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
post #6 of 14
Quote:
Originally Posted by Alanim View Post

So I was just theory crafting, is it possible to use molten tin to bind a heatsink to the IHS of a CPU. I'm mostly concerned if the tin will be able to bind correctly to the aluminum IHS and copper/aluminum heatsink, without killing the CPU and if sufficient contact between the two materials will be made. Concerns below.

1. Will the CPU survive the brief exposure to the high temperature? I'm thinking yes.
2. Will this trap air between the surfaces?
3. Will the surfaces bond together correctly, with good contact?
4. Could it be done thin enough to provide net benefit?

So does anyone know if this has been tried before(I couldn't find any results on google). Also how plausible do you guys think this is.

Thoughts?

Tin is a horrible thermal conductor. Just to give you an idea of how bad ...

Tin has a thermal conductivity rating of 66 WmK

Compare that to:

Copper 401 WmK
Silver 429 WmK
Aluminum 237 WmK

So, even if you could bond the IHS directly to an aluminum or copper heatsink, you'd be doing so with a metal that's at least most 20% as thermally conductive. Not good.

Greg
post #7 of 14
Thread Starter 
Quote:
Originally Posted by hammong View Post

Tin is a horrible thermal conductor. Just to give you an idea of how bad ...

Tin has a thermal conductivity rating of 66 WmK

Compare that to:

Copper 401 WmK
Silver 429 WmK
Aluminum 237 WmK

So, even if you could bond the IHS directly to an aluminum or copper heatsink, you'd be doing so with a metal that's at least most 20% as thermally conductive. Not good.

Greg

This is why you'd want as thin a layer as possible. It's still TWICE the thermal conductivity of the high end TIMs

The reason for using tin is because it has such a low melting point. Copper/Silver/Aluminum would likely cook the CPU and be much harder to melt down then tin.

You can also make an alloy with Silver-Copper-Tin that "might" increase the thermal conductivity a bit(I'm unsure of the thermal properties of this alloy), for only a modest increase in melting point.
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
post #8 of 14
Thread Starter 
*edit* Double and triple post >.>... I keep forgetting to tab to submit.
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
post #9 of 14
Thread Starter 
*edit* GAHHHH
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
My Rig
(5 items)
 
  
CPUMotherboardGraphicsRAM
A8-5600k BIOSTAR Hi-Fi A85S3 FM2 HD 7560D Integrated GPU Team Vulcan 8GB (2 x 4GB) DDR3 1600 
Hard Drive
TOSHIBA P300 HDWD110XZSTA 1TB 7200 RPM 64MB Cache 
  hide details  
Reply
post #10 of 14
why don't you just get rid of the ihs?
New Posts  All Forums:Forum Nav:
  Return Home
  Back to Forum: Cooling Experiments
Overclock.net › Forums › Cooling › Cooling Experiments › Tin TIM