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post #11 of 14
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Quote:
Originally Posted by ghostrider85 View Post

why don't you just get rid of the ihs?

I'm unsure if the CPU die can take the heat directly, although I guess it might work since the CPU won't be receiving electricity?

Does the thermal limits of a CPU only apply while it's receiving electricity, because if so, that'd be worth a try.
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post #12 of 14
Quote:
Originally Posted by Mattb2e View Post

Tin is one of several metals used to make alloys that can be used to make solder. So technically tin has been used in-between the IHS and CPU die for several generations, just not in a 100% concentration to my knowledge.

Right. The interface used between the die and the IHS is an Indium-tin alloy that melts at around 140ºC.

As for IHS direct heatsink contact, does anyone remember the Athlon XP and Pentium 3 days? Those processors ran naked. As well as the vast majority of laptop processors currently in use.

Heck, so does my A10-5700. Workin' damn fine by the way.
Quote:
Originally Posted by hammong View Post

Tin is a horrible thermal conductor. Just to give you an idea of how bad ...

Tin has a thermal conductivity rating of 66 WmK

Or in other words, ten times higher than your average high performance thermal grease. Bad is always a relative term... wink.gif
   
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post #13 of 14
Quote:
Originally Posted by Alanim View Post

Well doing it with 100% tin would be the easiest way for someone to attempt this, I assume.

You could do it with a alloy such as tin-silver-copper as well, but that'd be a bit more expensive and harder to make/obtain.

Also, I've heard the IHS is made of copper, it's just easy to forget due to the color of it. Nickle plating I assume?
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post #14 of 14
Quote:
Originally Posted by Artikbot View Post

Or in other words, ten times higher than your average high performance thermal grease. Bad is always a relative term... wink.gif

No doubt that tin is a better thermal conductor than a blob of paste, it's the interface between the tin and the other metal that becomes the challenge. =) I'd have to agree with the previous recommendation that if your goal was to reduce thermal resistance to a minimum, that removing the IHS and applying the heatsink material directly to the back of the core would give you the best heat transfer. And reduced risk vs. heating the core to temps sufficient to melt a tin/silver allow.

Greg
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