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Deliding a 4770K (Haswell). Improving temperatures and maximizing overclockablity. - Page 106

post #1051 of 1134
Better go direct-die or with IHS on ?

It seems direct-die would be a bit better for temps, but then some posts/threads got me confused again.

That's for a delidded and watercooled 4670K
post #1052 of 1134
For my first delid project I'm planning on using EK's Supremacy PreciseMount on the bare die with GC-Extreme. I'd rather be careful and mess with that then liquid metal, even if it's harder with no performance boost. Screws are big and you can adjust them slowly. Liquid metal droplets are tiny and look like a mess to apply and clean. Then the IHS is all lose anyway. I'd rather just remove the IHS from the equation personally. Just a thought that crossed my mind.
Edited by Neo Zuko - 3/25/14 at 12:33am
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post #1053 of 1134
Quote:
Originally Posted by Neo Zuko View Post

For my first delid project I'm planning on using EK's Supremacy PreciseMount on the bare die.

Yea that's what I thought to do

Now I will see how liquid metal works and what are the pros and the cons

EDIT: So liquid metal can be used on the IHS only ? or directly on the chip too ?
Edited by White Wind - 3/25/14 at 1:25am
post #1054 of 1134
I'm no expert by any means (and I could be dead wrong) but I've gathered a few impressions from reading posts on OCN. CLU seems to be used more between the CPU die and IHS than between the IHS and CPU waterblock as CLU is most likely a huge hassle. It's a harder to apply, conductive, surface marring, and (dangerously?) fluid substance that's harder to cleanup. The CPU die and IHS connection is out of the way, more of a do it once situation. I don't think most people want to mess with CLU when changing blocks out or doing loop maintenance. They most likely use it to compensate for the IHS layer and Haswell's small die area. And there is less of a pump-out effect with CLU. That was my takeaway anyway. Otherwise everyone would be using CLU for both sides.
Edited by Neo Zuko - 3/25/14 at 2:23am
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post #1055 of 1134
Okay so applying liquid metal between die/block is possible, some people do it.
Quote:
Originally Posted by Neo Zuko View Post

fluid substance that's harder to cleanup

Apparently Collab sell metal cleaner
Quote:
Originally Posted by Neo Zuko View Post

And there is less of a pump-out effect with CLU.

Sorry I don't understand what that means
post #1056 of 1134
It runs off the sides of the small die due to concentrated heat. Your guess is as good as mine on that one.
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post #1057 of 1134
Well somehow I failed de-lidding mine mad.gif. I tried the vice method and it would not budge. I even tried different vice as it kept slipping out of 2 of them. I ended up denting one of the corners of the IHS (due to slippage) so I went and got a new one. Oh well...

Anyway, the old chip was L318B732 Malaysia and it was struggling to do 4.4 @ 1.34.

The new one is 3333C121 Costa Rica (was able to go through my local Microcenter's inventory to find a CR) and it seems to be stable @ 4.5/1.25.

Although it sucks I couldn't de-lid the other one, I am happy with the replacement/upgrade. I am keeping the lid on this one since it will be under water and seems to like lower voltage so temps should be a lot better.
post #1058 of 1134
Did you ruin the chip itself?
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post #1059 of 1134
Quote:
Originally Posted by Neo Zuko View Post

Did you ruin the chip itself?

I don't think so, but I didn't test it out. I am guessing it will work fine, but for right now it is back in it's box. Whatever damage was done to the IHS should be fixable with some light 2500-3000 grit sanding. I might try it again in a few days and just cleanup/lap the IHS.
post #1060 of 1134
You could also direct die cool via EK's Supremacy CPU block and EK's PreciseMount adapter.
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