Originally Posted by slash621
Thanks a bunch for the CLU answer. I'm a regular on some other OC forums so I know the drill regarding the sigs and whatnot, just joined from the office so I haven't had time to pimp my ride yet. So the CLU, you mount it between the DIE and the LID? or between the Die and the Heatsink for direct contact? If it is direct contact... do you need to get a custom mount from the heatsink maker? (I have a Noctua NH-D14)
I just picked up a 4670K and am considering lidding it before my install.....
Most everyone uses Ultra or Pro on the die of their delidded chip, but only a few of us use it in between the IHS and the cooler. It does give a few c better temps than standard TIM when used on top of the IHS, but it can be a real pain to clean off later. I don’t recommend that people use it there unless they know what they will be dealing with later, but in between the die and IHS it is essential.
Some people go direct die but you will need a certain kind of cold plate and mounting hardware to allow that, and you usually need to remove the retention bracket from the mobo. You can get a few c better by doing direct die but it can be tricky to get the mounting pressure just right. Therefore the large majority of delidders just put the IHS back on since it is easier.
For Haswell, I would do the vice/hammer/block of wood method, just make sure you get a vice that will not move in any way at all. Then you have to cover the exposed contacts on top of the pcb with MX-4 or something completely nonconductive since you can’t get any Ultra or Pro on them.