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TIM degradation over time

post #1 of 3
Thread Starter 
I've been playing around with formulating my own thermal paste for the sake of experimenting. So I've been experimenting with mechanical interfaces.

I've been reading here on the forum that some guys are having their TIM work well and initially drop temps, but a couple of weeks later the temps are going back up again. I don't know if this is a chemical problem, or a mechanical problem. I highly doubt that at these temperatures that the TIM is breaking down chemically. With uneven mechanical loading of the heatsink/pump via the fasteners to the motherboard there may be issues with consistent surface area contact over time. Especially if you install the heatsink in a horizontal orientation and then stand up the case vertically with a 2 lb heat sink, then there's definitely going to be uneven mechanical loading on the interface.

See picture below, the OD of the interface is the original surface area contact, and the dense ID is after the mechanical interface settles in.


post #2 of 3
Usually it is related to fast and granular temperature changes. TIM pump out is when repeated heat cycling eventually causes the TIM to migrate and degrade in performance over time. The best way observe this phenomenon is bare die CPU (like delidded 3770k).
post #3 of 3
Thread Starter 
So, this is mostly the delid guys and the thermal cycling is making the IHS physically pump TIM out?
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