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[xbitlabs] UMC joins IBM chip alliance for 10nm process development

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Thread Starter 

Taiwanese chip foundry United Microelectronics Corp. (UMC) will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.

Quote:
“Established over a decade ago, the IBM alliance allows the partners to leverage our combined expertise and collaborative research and innovative technology development to address the demanding needs for advanced semiconductor applications. UMC is a strong addition to the alliance,” said Gary Patton, vice president of IBM semiconductor research and development.

The agreements between UMC and IBM expand upon their 2012 agreements concerning prior nodes, including 14nm FinFET. With IBM's support and know-how from this collaboration, UMC will continue to improve its internally developed 14nm FinFET to offer industry competitive low-power technology enhancements for mobile computing and communication products.

The parties plan to develop baseline 10nm process technology to meet the needs of UMC customers. UMC will send an engineering team to join the 10nm development work that will take place in in Albany, New York, while UMC’s 14nm FinFET and 10nm implementation will take place at UMC’s Tainan, Taiwan R&D site.

“IBM is a recognized leader in fundamental semiconductor technology. We are extremely pleased to work jointly with IBM on advanced fundamentals, and to contribute our many years of experience in developing highly competitive manufacturing technology. Our role as one of the world’s top foundries requires us to introduce leading-edge processes in a timely manner to enable next generation customer chip designs. We look forward to collaborating closely with IBM, leveraging their deep technology expertise to shorten our 10nm and FinFET R&D cycles and create a win-win situation for UMC and our customers,” said Po Wen Yen, chief executive officer of UMC.

xbit labs

official IBM press release

official UMC press release
Quote:
In a statement released Thursday, UMC said it had set up an alliance with IBM to join the IBM Technology Development Alliances as a participant in the development of 10nm process technology.

The Taiwanese chip maker said it will send an engineering team to IBM's 10nm process development center located in Albany, New York, and hoped to complete the first phase of development by the end of 2014.

UMC said the alliance with IBM is expected to speed up the pace of 10nm process development. UMC and IBM have already been working together on the 14nm FinFET (fin field-effect transistor) process since 2012.

"The market does not expect UMC to launch commercial production of chips using the 10nm process in the short term. It will take time," Hsu said.

Rival Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chip maker, is scheduled to begin mass production of chips using the 10nm process in 2017.
Focus Taiwan
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post #2 of 5
Thread Starter 
IBM Common Platform Alliance


"The over ten years ago, IBM launched Technology Development Alliance brought, among other things, the Alliance Common Platform forth, which, in addition to IBM and Samsung and GlobalFoundries count. The latter group is a pure contract manufacturer and thus a direct competitor of UMC. Indirectly could both benefit from cooperation. Because of the complex and increasingly expensive manufacturing processes accordingly puts together the semiconductor industry and is looking for solutions." CB


With bulk 32/28nm and earlier technology nodes already in volume production and 20nm development near completion, dedicated resources from IBM, Samsung and GLOBALFOUNDRIES are focused on the development of the 14nm bulk node which will introduce FinFET technology, providing the next generation of process scaling with low voltage operation.

Our comprehensive and open ecosystem of industry leading design enablement and implementation companies deliver optimized solutions targeted for the mobile world.


Common Platform Alliance Announces Fast Track to 10XM Process in 2015 @brightsideofnews
Quote:
At the 2013 Common Platform Technology Forum, recently held in Santa Clara, CA - the alliance members announced their new roadmap, accelerating the new manufacturing processes in a bid to set the pace of the industry.

As you can see in the roadmap below, the Common Platform members will accelerate the introduction of new manufacturing processes. The 20nm Planar LPM is getting introduced over the course of this year, but next year will see the adoption of FinFET transistors with the 14XM process, and that will continue with the 10XM process in 2015.

According to Jean-Marc Chery, CTO of ST Microelectronics, there's a level of annoyance with the way how Intel named its 22nm FinFET process, while in fact those transistors are closer to the 26nm process. Naturally, if you are in semiconductor industry, you know that all of these numbers are quite "wide off the mark", and the way how industry calculated the transistors no longer works when 3D transistors, or FinFETs are involved. This was confirmed by Warren East,

Thus, Common Platform decided to continue naming its processes with the industry standard, but they are making a clear distinction that their 14XM and now the 10XM are "14nm and 10nm FinFET transistors on a 20nm or 14nm process". There is a particularly good reason for this, as we are approaching to boundaries of modern lithography, before the whole industry makes the jump to EUV (Extreme Ultra-Violet) process.

Common Platform confirms 14XM on track for next year and the launch of 10XM process in 2015.



GlobalFoundries Accelerates Adoption of 20nm-LPM and 14nm-XM FinFET Processes with New Design Flows @xbitlabs

GlobalFoundries Unveils New Design Flows for 20nm-LPM and 14nm-XM FinFET Processes


Quote:
GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support its most advanced manufacturing processes. The flows, jointly developed with the leading EDA providers, offer robust support for implementing designs in the company’s 20nm low power process and its leading-edge 14nm-XM FinFET process. Working closely with Cadence Design Systems, Mentor Graphics and Synopsys,
GF has developed the flows to address the most pressing design challenges, including support for analog/mixed signal (AMS) design, and advanced digital designs, both with demonstration of the impact of double patterning on the flow.

The GLOBALFOUNDRIES design flows work with its process design kits (PDKs) to provide real examples that demonstrate the entire flow. The user can download the design database, the PDK, detailed documentation and multi-vendor scripts to learn how to set up and use the GLOBALFOUNDRIES design flow. The flows use open source examples and provide the customer with working, executable and customizable flows.

“As the developer of the industry’s first modular 14nm FinFET technology and one of the leaders at 20nm, we understand that enabling designs at these advanced process nodes requires innovative methodologies to address unprecedented challenges,” said Andy Brotman, vice president of design infrastructure at GLOBALFOUNDRIES. “By working with a new level of collaboration with EDA partners, we can provide enhanced insight into our manufacturing processes in order to fully leverage the capabilities of 20nm and 14nm manufacturing. This provides our mutual customers with the most efficient, productive and risk-reduced approach to achieving working silicon.”
Yahoo Finance



Intel has the best foundries in the world. want a cookie?

Intel's Broadwell is delayed to 2015

asder00

Haswell has no overclocking for non K model processors, while K model CPUs are stripped of Virtualization and TSX Features.
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post #3 of 5
Sometimes I think the best possible outcome for AMD, would be to become profitiable enough for IBM to want to purchase them. tongue.gif
post #4 of 5
Never tickle the sleeping dragon.


I know it's Hogwarts' motto...
   
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post #5 of 5
Quote:
Originally Posted by Meirleach View Post

Sometimes I think the best possible outcome for AMD, would be to become profitiable enough for IBM to want to purchase them. tongue.gif

IBM doenst work on consumer products directly. If IBM took AMD, you wouldnt be able to conventionally buy an AMD processor in the store. You would have to buy it from another company who contracted with IBM to purchase a unit.


edit: Which is why IBM sold part of their departments to Lenovo
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