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[VR-ZONE] Intel 2014 Haswell-E to pack 8 cores, DDR4, X99 PCH and more - Page 40

post #391 of 616
NO! what you need is a solid diamond water block. wink.gif
Edited by USFORCES - 6/19/13 at 2:36am
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post #392 of 616
Quote:
Originally Posted by DaveLT View Post

No. You can't delid SB. kookoo.gif

Yes you can.
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post #393 of 616
Quote:
Originally Posted by 2010rig View Post

The 3960X is actually more expensive than the 3970X on NE, LOL.

3960X
http://www.newegg.com/Product/Product.aspx?Item=N82E16819116491

3970X
http://www.newegg.com/Product/Product.aspx?Item=N82E16819116877

Lmao
post #394 of 616
Quote:
Originally Posted by Blameless View Post

Quote:
Originally Posted by DaveLT View Post

No. You can't delid SB. kookoo.gif

Yes you can.

Not with any reliability and any solder left on die has a good chance of cracking the die once the cooler is clamped.

Something not be recommended.
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post #395 of 616
Quote:
Originally Posted by OverclockerFox View Post

All this talk about TIM and the IHS gave me a strange idea.

What if you de-lidded an Ivy Bridge or Haswell and hard-packed the lid with powdered copper, either by itself or suspended in some sort of resinous compound, then glued the lid back on? Could that work for helping heat dissipation? thinking.gif

Interesting idea but it wouldn't really work. Powdered anything has air between the grains so powdered copper would behave like thermal paste with air bubbles. Copper suspend in paste would just behave like whatever the paste it was suspended in. For the copper to be effective it needed to be an uninterrupted connect between the die and the IHS.
Edited by serothis - 6/19/13 at 4:34am
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post #396 of 616
Quote:
Originally Posted by serothis View Post

Interesting idea but it wouldn't really work. Powdered anything has air between the grains so powdered copper would behave like thermal paste with air bubbles. Copper suspend in paste would just behave like whatever the paste it was suspended in. For the copper to be effective it needed to be an uninterrupted connect between the die and the IHS.

Something like non conductive ferrofluid or mercury? Now we're talking. In fact, ferrofluid is often used in heat transfer applications.
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post #397 of 616
I feel like games will be more highly-threaded than in the past thanks to the new consoles. Having those extra cores could mean a decent wumph of extra power.
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post #398 of 616
Quote:
Originally Posted by Syan48306 View Post

But that's my entire point. The internal heat spreader CAN be considered a semi closed system. Heat is trapped on the spreader by 1. normal (imperfect) contact with heatsink and 2. piss poor performance of paste TIM between the heatsink and IHS.

TranquilTempest also agreed with this fact, picking out technicalities I choose to ignore because while true, it doesn't change the overall outcome.
Like I said pure copper has a thermal conductivity of 400 W/mK while paste TIM is somewhere around 4-5 W/mK. The best paste based TIMs are somewhere in the 6 W/mK. That's still a 100 times difference. At those differences, it's like heat shoots through the copper EDIT: vertically first, and then hits a brick wall at a layer of paste TIM. Then it moves out radially. Now does it make a bit more sense?


I don't believe there is a significant difference in the thickness of the dies. They did go to the Tri-Gate transistor design but overall it should be a negligible increase in thickness and mass.

Why do you put tim between the heatsink and cpu heat spreader anyways? If copper has a thermal conductivity of 400 w/mk and the heatspreader also has a thermal conductivity of 400w/mk. Adding Tim between the heatspreader and the heatsink is done to fill the gaps, or increase the surface area of the cooler making contact with the heat spreader.
post #399 of 616
Man, finally good news. Something worthy of upgrading from X58 IMO. If they sold an 8 core K version at $700-800 I would buy it.

I'm going to start saving up $1500. $800 for CPU, $350 for Motherboard (Asus or Evga), and $350 DDR4 2133mhz (Corsair) would be my estimate on how much its going to cost me. Not bad, if it last me as long as my X58 has then I'll be extremely happy. Worth it for me

*Not counting waterblock for the motherboard, CPU, and memory. Will be expensive but seems like it will be a long lasting platform.
Edited by royalkilla408 - 6/19/13 at 6:43am
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post #400 of 616
Maybe now, I will upgrade my i7-930 build. Fingers crossed for a good performance gain of 40% above Bloomfield
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