Originally Posted by Melee
I completely overlooked this post, I apologize.
They are double sided Hynix CFR. Corsair doesn't hide their ICs on these as most companies do. They fully disclose the ICs they use in each model. I'll be away from home for the rest of the night but I'll try to post pics when I get home in the morning.
Do I need to fully remove the heatspreader? I've never done it before and don't want to damage anything. If it's easy enough, I'll do so and take some pics just to ensure the legitimacy.
From past experience, Corsair will usually disclose the manufacturer but not the specific model (i.e. V2.X for Elpida). This definitely could have changed, but it's what I remember.
Hynix CFR is some pretty good stuff for sure. I have the 2666C10 Samsung kit and it's a dream.
You don't need to take the heat spreaders off at all (and shouldn't--Corsair glues the spreaders to the IC's). You can just glance under the spreaders holding them up to the light to see if there are chips on both sides of the stick.
Double sided memory is preferable over single sided because it has bank interleave, which can significantly increase read and write performance to the memory in heavy-usage applications. This adds up to about 15 seconds difference at Super Pi 32M with a 4770K at 5GHz.