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[ OL ] WSJ: TSMC finally has a deal with Apple; that may present an opportunity for WaferTech in Camas

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When TSMC starts making Apple’s chips – perhaps as soon as next year, the WSJ reports – it will almost certainly do so in Taiwan, home to TSMC’s most advanced fabs. The WaferTech fab uses less efficient, 200-millimeter silicon wafers and makes chips using larger circuitry that is well behind the leading edge technology Apple seeks.

A brand-new fab at the site, though, could use the emerging 450-millimeter standard and leading-edge circuitry. Even if TSMC committed to build tomorrow, though (and recent indications suggest no decision is likely before fall), a new Camas fab would likely be three years away.


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Intel i7 3930k @ 4.8Ghz Asus Rampage IV Extreme (Koolance Full WB) Zotac GTX 680 AMP Edition Waiting for HD 9970 QuadFire 
RAMHard DriveOptical DriveCooling
Corsair Dominator GT 2133 Ghz (16GB) (128GB Crucial M4 - 64 GB Patriot Pyro SSD) 1x1... LG Blue-Ray Burner Fully Custom 
OSMonitorKeyboardPower
Windows 7 Ultimate x64 3 x CrossOver 27Q Led-P 1440p (Eyefinity 3x1) Logitech G15 Lepa G 1600 (1600 Watts) 
CaseMouseMouse PadAudio
Corsair Obsidian Heavily Modded Logitech G700 RocketFish Speed/Control M-audio AV-40 (Logitech G-35) 
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Originally Posted by KaRLiToS View Post

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The original WSJ post is already being discussed here, no need to open another thread.
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Overclock.net › Forums › Industry News › Hardware News › [ OL ] WSJ: TSMC finally has a deal with Apple; that may present an opportunity for WaferTech in Camas