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Direct die cooling water block - Page 2

post #11 of 17
+Repped for risking your computer parts for extreme bench results smile.gif

I've always wondered what kind of temps you could get if you ditched the IHS, but never willing to risk parts unless I was filthy rich.
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post #12 of 17
Thread Starter 
Here are the results for the direct die mounting, without IHS:

Water inlet temperature: 23.65C
Core package average: 69.6C
Delta core/water: 49.05C
Flow rate: 1.17 Gallon/min


This is how I applied TIM:


In summary direct die mount does reach about 5C lower core temp than with IHS on! During benching the temperature improvement is very noticeable.



This is with direct mounting of KOC WXE over the die, without removing CPU retention, two nylon washers are added in the retention to ensure CPU mounting pressure. The waterblock then can be mounted with "figure 8" tightening method. I have repeated it twice and got consistent results.

I have also tried to add a thin silicon rubber pad which is slightly (very slightly, may be 5-10 thousands of an inch) thicker than the die. I thought it could help protect the die and balance the mounting. But the performance with this method is poorer than with IHS on by about 1C core temp. The reason I think is the additional forces required to compress the rubber, it offsets the mounting pressure and affects contact between silicon die and waterblock. So unless you are sure about the mounting pressure, adding rubber pad is not recommended.


If you decide to do direct die mounting, you are aware of the risks as I have sacrificed a processor. Be sure to use "Figure 8" method to tighten the screws and constantly check the compressing of springs are even. It is also good practice to tape the surface of the PCB to prevent scratching. Don't tape the surface mount caps! Because they are only a little shorter than the die, with tape it will be higher than the die.
Edited by foxrena - 7/6/13 at 2:13am
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post #13 of 17
Thread Starter 
Prime95 run with direct die:

P95 Blend default settings
Water inlet: 24.14C
Core package average during: 67.6

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post #14 of 17
Thread Starter 
Cienbench 4.8GHz score and temp with direct die:

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post #15 of 17
Thread Starter 
Hi guys I have cracked 5GHz using TEC. Please have a look:


I tested 4770K under my TEC block (KOC T38). As expected, core temperature improve dramatically over water cooling, and I was able to get some decent results. This particular 4770K I used is about average, with VID at 1.056V. So I couldn't crack 5.1Ghz stable this time. Maybe a re-mount will help rolleyes.gif Anyway here are the results:
(The stock paste on silicon die was replaced with MX-4 in all tests)

5.3Ghz Super Pi, 1.55V, TEC at about -20C:


5GHz Cinebench, 1.44V, Score 10.88, TEC at -5C max


I can run 5GHz AIDA tests for a while, but I didn't test it for like 12hrs. The load TEC cold plate temperature saturates around 1-3C at 5Ghz. This is the TEC block I use. See This Thread for details.



Comparison of core temps using different cooling methods:

*Benchmark software used: AIDA (ver 3.0) stability test. Core temps are taken from the core package average after all temps are stabilized. Water temperature is taken at the water block inlet. Ambient temperature is between 23-26C.

Detailed results:
Koolance CPU380
KOC WXE, IHS on
KOC WXE, IHS off
KOC T38


This is something that can be best measured using TEC: Core temp v.s. IHS temp. Since I have a controller that can lock the cold plate at any given temperature. Here are the results:

Core temp scaling of 4770K:

Yes, the slope is >1! It means if you lower your heatsink temperatue for 10C, you will lower your core temps for more than 10C. It has been like that since the first generation of Core i processor. Ivy bridge has a slope of 1.33 in this temperature range.
The graph is easy to read, for example when cold plate is at 25C you will have average core temps of 71C, and when cold plate is at 0C you will have 42C average core temp.
GT core I think is the graphics core temp. I use PCI-E video card so the GT core is not enabled. It shows the temperature at that part of silicon die.
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Obsidian
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post #16 of 17
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Edited by dr/owned - 7/24/13 at 2:49am
post #17 of 17
Thread Starter 
Quote:
Originally Posted by dr/owned View Post

Direct die mounting without the retention bracket isn't really difficult to do. I've done it twice now. Because the waterblock (380i at least) extends past the footprint of the socket, so you can wrench the thumb screws down all the way since the block will eventually be resting against the walls of the socket and not crushing the die.

Been there done that since i7-920 (soldered IHS!).
But being able to keep the CPU retention is always nice.rolleyes.gif
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Obsidian
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CoolingCoolingCoolingCooling
MCP 35X pump Swiftech Apogee XT waterblock Foxrena's Water Rack KOC TEC and Fan controller 
CoolingOSMonitorKeyboard
KOC 62mm TEC block Windows 7 Ultimate Dell UltraSharp IPS 27'' 2560x1440 Razor Black Widow Ultimate 
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