Originally Posted by Elloquin
Looks good so far Fox. My two bits. 1. That is going to need a back plated for the back of the motherboard. The 2 x 50 block I ran needed one other wise it actually warped the board. 2. You only need a total of 6 screws for the joining of the hot and cold plates. It really makes a difference in thermal transfer. 3. The base should be pyramid shaped as opposed to square to spread the heat horizontally and take better advantage of both TECs. Look at the base of Swiftech's old TEC blocks. Lastly 1/2" thick is just a waste. save material there to make a better pyramid base.
Hi Elloquin, it's very nice to have your comments!
I totally understand your concerns.
1. I completely agree, it will be in the process.
2. I understand fewer screws are better for even mount (from reading technical notes on web). Actually there are only 4 screws holding together the hot and cold plates (if you look at the cold plate picture)
. The other 6 screws are for the top plate to hot plate. I calculated that there should be at least 125lb from each of the 4 screws which seems quite big. I bought some high strength socket screws and 60+lb Belleville washers and hopefully there will do the tasks.
3. I have the choices of 3/8'' and 1/2'' thick copper. I did some finite-element simulations to calculate the optimal thickness (using Comsol Multiphysics). 3/8'' was noticeably worse than 1/2'' in simulation. So I just use 1/2 to be on the safe side. Yeah it's very chunky and the weight is a drawback!! The 0.15'' thick bottom square in my design is needed to clear the components around the sockets, especially caps (my Gigabyte mobo has some tall caps!). I will think about milling the rest of the 0.35'' copper into a pyramid shape. It should help reduce the weight significantly. I need to figure out how to insulate that nicely first.