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Reason why Intel used cheap TIM (theory)

post #1 of 11
Thread Starter 
My theory is that the GPU part of the die cannot handle the fluxless solder (probably because of heat).

Look at it this way: an intel i3 1st gen has fluxless solder on the CPU die, but cheap TIM on the GPU die. After intel integrated the GPU into the CPU die since ivy bridge, they can no longer use solder on the CPU-GPU die since the GPU can't handle the solder.

Picture proof:


The reason why Ivy-E is still soldered is because it lacks an iGPU.

Also, look at it this way: AMD uses solder on the FX line, but uses TIM on the APUs, also probably because the GPU can't handle it.


This is just a theory, take it with a grain of salt.

That's enough logic for me for the day, I'm out thumb.gif
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post #2 of 11
Sandy has an iGPU and it was soldered.
post #3 of 11
Thread Starter 
Quote:
Originally Posted by Forceman View Post

Sandy has an iGPU and it was soldered.

Maybe the GPU die is seperate from the CPU die, just like my i3 1st gen.

Maybe sandy have TIm on the GPU like my i3 as well.

Anybody delided a sandy before?
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post #4 of 11
Quote:
Originally Posted by TheLAWNOOB View Post

Maybe the GPU die is seperate from the CPU die, just like my i3 1st gen.

Maybe sandy have TIm on the GPU like my i3 as well.

Anybody delided a sandy before?

I'm sure it has been delided and it's solder, not TIM. The only reason they use TIM on the GPU is because it's rarely overclocked so there's no need for solid cooling. They saved some buck that way before and they decided to save some more by using TIM on the CPU too, that's all there is to say.
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post #5 of 11
It's integrated. Interesting theory, but I think it is either cost or some issue with the size/shape of the die. There was speculation that they switched because the longer narrower die of Ivy (and now Haswell) was prone to cracking from the thermal changes.

http://www.pcmag.com/slideshow_viewer/0,3253,l=258556&a=258561&po=2,00.asp
post #6 of 11
A. probably cheaper
B. This cheap TIM works just fine at stock settings
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post #7 of 11
Quote:
Originally Posted by Forceman View Post

It's integrated. Interesting theory, but I think it is either cost or some issue with the size/shape of the die. There was speculation that they switched because the longer narrower die of Ivy (and now Haswell) was prone to cracking from the thermal changes.

http://www.pcmag.com/slideshow_viewer/0,3253,l=258556&a=258561&po=2,00.asp

more likely that!

what it cost for solder they could have added to the cost - and we would still buy biggrin.gif
post #8 of 11
What does "GPU can't handle the solder" even mean?
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post #9 of 11
Actually it isn't the cheap tim. The problem is the gap between the ihs and die.
     
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post #10 of 11
Thread Starter 
Quote:
Originally Posted by DuckieHo View Post

What does "GPU can't handle the solder" even mean?

I was thinking that maybe the GPU can't handle the heat required for soldering.

That would explain why intel used solder for the CPU and TIM for the GPU on my i3.
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