Originally Posted by Dmitriy
I use CLP on die surface.
Ah, then the cracks are almost certainly propagation of damage done while delidding.
Originally Posted by HairyGamer
I feel like the vice method is either bowing the IHS or causing micro-fractures from hitting with a hammer. I will wait and see if anybody like myself who used the razor method has this issue. If so, we need to rethink what we're all doing here
Even the razor method flexes the CPU substrate and die to a degree, possibly enough to cause damage in certain cases.
Part of the problem is the extreme rectangular shape of these dies and their thinness. They aren't very strong, can't be flexed far, yet the shape makes them prone to flexing.
I long for the days of thick, ceramic, substrates.
Originally Posted by janas19
Fair enough, that makes sense so I can't even argue with your reasoning.
I also had this inclination.... I'm beginning to wonder if the hammer and vise method might not "bow" the PCB for a fraction of a second, as the hammer strike impacts the wooden block? It's very possible, in fact it seems to make sense.
I guarantee that if you watch the hammer method filmed with a high speed camera you'd see substantial vibration/flexing.
Originally Posted by alancsalt
With Haswell only though.
Something to do with die shrink or internal lattice making Haswell more vulnerable?
The manufacturing process should have nil effect on strength of the die, but die shape and wafer thickness certainly do.