Originally Posted by Inglewood78
Blunt force shock from vice/hammer delid may have caused microfractures on the die that explanded when stressed, cause the cpu to kaput.
Except people have been using the hammer method on Ivy chips for quite a while without any of this, so unless there is something specific about Haswell dies it can't be just from the hammer method.
Plus you'd expect any blunt force trauma to be in the PCB, not the die - I really doubt that much energy is being transferred to the die (as opposed to being absorbed by the PCB). Breaking PCBs would be a dead giveaway, breaking cores not so much.
My theory is the reason Haswell is hotter is because Intel increased the spacing between the IHS and die with thicker glue, in part because the die is more fragile. Taking that protection away is leading to cracked dies.Edited by Forceman - 8/10/13 at 11:47pm