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[VRZ] Ivy Bridge-E HEDT Core i7 is actual six-core Xeon die

post #1 of 4
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http://vr-zone.com/articles/ivy-bridge-e-core-i7-is-actual-6-core-xeon-die/50572.html
Quote:
The impact? A big plus compared to the old crippled gigantic eight-core 32 nm die with three out of four of its cores enabled. Now, it is a comparatively small six-core die without the huge graphics portion, but with lotsa PCI-E v3.0 and very wide memory should have very good O/C potential in the production version, since Intel had an extra year plus to solve any leakage problems on the 22 nm FinFET process. Also, we assume, Intel will continue to use soldered heat spreader solution on high end LGA2011 chips, rather than the el cheapo toothpaste seen on the desktop Ivy Bridge chips.
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post #2 of 4
Nice. But doesn't explain the still 130W TDP figure. Which means a high-leakage version of the 6-core native Xeons? I know 3960x is 150W TDP but still. 22nm finfet was said to bring up to 50% power drop
Looks like it really only done it's work well on mobile (Ha! Intel doesn't give a hoot to us) and it did not scale well on the extreme side either

Does anyone else cringe when hearing the term "el cheapo toothpaste" used to describe the TIM Intel is using? The TIM Intel actually used is rather high-quality
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post #3 of 4
Yeah, they just use to much of it, lol. Solder is bettah....
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post #4 of 4
Quote:
Originally Posted by jcharlesr75 View Post

Yeah, they just use to much of it, lol. Solder is bettah....
It's a fact that it's not about using too much but rather only very expensive thermal paste (and risky ones on top of that, you guys know what i mean. Liquid Pro/Ultra or Indigo Extreme) and silver solder is expensive ... so Intel (not caring for enthusiasts on mainstream once again) just went for the cheaper option since it "just works" on stock heatsinks. That's all they care for
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