Originally Posted by PureBlackFire
better top ventilation.
The top cover doesn't impede ventilation in the slightest, like none (at least with my configuration, refer sig). I spent a number of hours overclocking for pre/post comparison on my 4790k delid and with the top panel on or off over a period of an hour (heat soak was completely set in by about 30mins) stress testing in AIDA64 and the CPU reached the same maximum package temperature with or without the cover on. The front panel however is a restriction.
Originally Posted by paskowitz
I/O should be easy since that is removable. Hell they could sell an upgrade kit to current Evolv owners.
This would be a ridiculously awesome idea, easy upgrade to give Evolv owners USB 3.1 front panel connectivity, could even do a VR front I/O for those that use it.