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Thermal Conductivity vs Resistance

post #1 of 6
Thread Starter 
Which one is the most important factor in choosing paste/tape/pads?

Trying to compare Sekisui 5760 with Fujipoly Extreme.

Sekisui:
Thermal Resistance: 0 C/W
Thermal Conductivity: 1.24(W/m*K)
Thickness: 0.14mm

Fujipoly:
Thickness: 1.5^±0.1 mm
Thermal Resistance: 0.21 °Cin^2/W
Thermal Conductivity: 11.0watt/mk
Volume Resistivity: 7.0 x 10^3 M Ohm(m)
Withstand Voltage: 11kV/mm(AC)
post #2 of 6
The higher the thermal resistance, the lower the thermal conductivity right?
Go for the one with the higher thermal conductivity.
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post #3 of 6
I'm not sure I fully understand this myself but here's my take on it.

Firstly thermal conducTIVITY (I'm deliberately putting the endings in caps) this is a feature of the material being used only and nothing to do with the size or thickness of the material it just allows a direct comparison between different materials.

Secondly thermal resisTIVITY....would be exactly the inverse of the above

Thirdly thermal resisTANCE is an actual measurement of the resistance of the item being considered and will depend on it's physical dimensions ie thickness as well as the material it is made of......so when considering two different pads of different materials and different physical dimensions then the thermal resisTANCE of the pad would tell you which is the better...obviously lower is better.

In your above comparison of the two pads the one is approx 10x thicker than the other but at the same time its conductivity is approx 10x greater so the two factors would basically cancel out giving very similar thermal resistance or at least minimal difference between them.
Edited by technogiant - 9/9/13 at 11:13pm
post #4 of 6
Thread Starter 
Thing is, one's a pad the other a tape.
post #5 of 6
Quote:
Originally Posted by MrSkim View Post

Thing is, one's a pad the other a tape.

Don't see where that makes any difference really?...the thickness and thermal conductivities are what they are regardless of what name we give it...tape or pad....they would both transfer similar quantities of heat energy for a given temp delta per unit of contact area....so it's whatever fits your usage scenario better really.
post #6 of 6
Thermal Resistivity is the reciprocal of thermal conductivity. Pretty much the same thing, just upside down. It is a measurement of the materials' used thermal properties, not the measurement of the actual products performance.

I'd use the thermal pad. As previously stated they will perform very similarly. The pad has the added benefit of easily ridding of air bubbles. Thermal tape is a PITA to apply properly. A small air bubble and you've just rendered it pointless. Pads USUALLY only require a single side to be mounted, and the other side is mounted via compression. Even if it does have a double sided adhesive the pad can be compressed, making it easier to keep the air bubbles out.

Since they both would perform similarly go for whichever one supports ease of use.
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