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I have a question about Tim on delidded haswell.

post #1 of 8
Thread Starter 
When thermal paste is reapplied are the pins, FPU, supposed to be covered also?? Or just the die is covered? I have just the die covered and if I run aida64 stressing FPU my rig spikes and throttles almost immediately and I stop the test. I am using a h100i for cooling and AS 5 for tim between die and ihs and cooling plate & ihs.

Any tips welcome. good temps on idle.
28°c if I just leave the sys. Alone. Under 70°c stressing the cpu alone. Add the fpu to stress test and it spikes to 100
Edited by OCingRookie - 9/22/13 at 1:50pm
post #2 of 8
AS5 has 200 hrs curing time and it is conductive also. u need to use something that is not metal conductive like Geild Extreme. if u use AS5, u need to cover contact with something first before u put AS5 on the die.
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post #3 of 8
It's pretty hard to get an optimal TIM application with something like AS5 on the die. Sounds like you used either too much or too little - I'd take it apart and check it, and then try re-applying.
post #4 of 8
Quote:
Originally Posted by OCingRookie View Post

When thermal paste is reapplied are the pins, FPU, supposed to be covered also?? Or just the die is covered?

I'm a little confused. Your Haswell only has one long chip, which includes the CPU/FPU. When you say you applied TIM to the CPU but not the FPU, how exactly did you do that, and WHY would you not put TIM on the FPU considering it generates most of the heat?

AS5 is a great paste, but a bad choice for this application. It's electrically conductive, and it if gets on the diodes/resistors that run along the length of the CPU, or spans pins in a connector, it will create a short.

I'd like to see a picture of your core with the lid removed, showing where you have the TIM applied and how much. Preferably before you clean it all off and replace it with Gelid or something non-conductive.

Greg
post #5 of 8
Thread Starter 
Outstanding. Thanks for the info. I actually just ordered CLP. The confusion was mine, Greg. I thought those resisters were separate fpu from the die. I'm new to this. I delidded my 4770 and scraped off that crap glue and tim. Used AS5 on die and cooling plate. Getting good temps on aida64 cpu stress but not when I stress the FPU. Worse when its cpu/fpu stress test. I don't put much stock into it cause I don't run anything real world that would stress my rig like that. Stable at 4.5 and 1.224 vcore.

I'll take pics of the application of CLP next week. I ordered that and a couple of sp120 quiet fans to replace the stock ones on my h100i. Thanks for the info on the diodes. I was thinking they had something to do with FPU.
Edited by OCingRookie - 9/22/13 at 12:08am
post #6 of 8

The TIMs that are normally considered a good choice (AS5, MX2, etc) aren't practical when we're talking Die -> IHS.

You corrected that mistake when you ordered Some CLP though :thumb:

 

If you need something to base your temps off, here are mine :

 

Here are my settings for 4.5Ghz:

Vcore : 1.33v

VRIN External Overdrive : 1.8v

CPU Ring Voltage: 1.15v

 

All tests run with stock fans at 100% speed in push configuration

 

Temps :

100% Load @ 4.5Ghz : Max of 98C.

100% Load @ 3.5Ghz : Max of 63C

Idle @ 4.5Ghz : ~40C

Idle @ 3.5Ghz : ~35C

 

My ambient room temp is 21C

 

I was able to get to 4.7Ghz @ 1.4v. I was hitting 100C as a max, but the air going through the H100I radiator was coming directly from an AC unit set on 60F. Of course getting this high on Haswell requires more than just playing with the vcore and multiplier.

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post #7 of 8
Thread Starter 
this is my temps before I delidded my 4770

this is after the delid. I removed glue off the die and replaced TIM with AS5. Pretty nice drop in temp if I do say so myself...

You asked to see images of temps. There you go.. The VCORE is set to auto. ASUS UEFI has been doing a very good job of regulating that setting so I've left it alone. 45x. I took it up to 46x stable but I left it alone at 45x. I think I can get it up to 47x--50x range... a lot of overhead to cover with the low temps I'm getting. Or maybe it's just wishful thinking on my part. :-)

No freezing, crashing or anything of the sort. Completely stable. I have a pic of delid but not of me applying TIM. When I get CLP I'll take pics of application. Which leads me to my next question. in between the Die and IHS I'll be using the CLP. Between the IHS and h100i do I use CLP or AS5?
post #8 of 8
Thread Starter 
Here is a couple of pics of my temps. Ambient of 24c-27c... I got no AC.. I'm a cheap bastage.. Rather not give Con Ed $200 month for cooling my place...
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