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Lap and delid question

post #1 of 6
Thread Starter 
So, I am going to lap and delid my i7 3770k today but I had one question. Most pictures I see during the lap process has the PCB and the IHS still together during the sanding process. My question is, is it safe for me to separate the IHS and PCB and then sand out the lapping process? It seems like this would be a safer way to ensure the PCB isn't damaged during lapping, but I don't know if people tend to keep them together while lapping for any other purpose.

Thanks,
Rylant
post #2 of 6
Well it shouldn't matter which way you do it, but I would delid it then lap it.
Just wondering are you planning or have a custom water loop for the cpu?
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(11 items)
 
  
CPUMotherboardRAMHard Drive
AMD A-3870K AsRock A75 Pro (FM1) HyperX DDR3 1866 8 GB SAMSUNG 830 256gb 
Hard DriveOptical DriveCoolingOS
SAMSUNG EcoGreen F4 2TB Plextor Black Blu-ray Burner Phenom II X4 stock Cooler Windows 10 
MonitorPowerCase
LG M2762D-PM Glossy Black 27" 5ms (1920x1080) Antec HG 900 Gerenic ATX Case 
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post #3 of 6
Lap it after you delid it that way its just the copper IHS. The last few grits are wet sanding so I wouldn't do it with the pcb attached.
post #4 of 6
Quote:
Originally Posted by kgtuning View Post

Lap it after you delid it that way its just the copper IHS. The last few grits are wet sanding so I wouldn't do it with the pcb attached.
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post #5 of 6
Thread Starter 
Hey thanks for all of the info here guys; it helped a lot. I have always dabbled in computers but never pushed them too far. I decided to try a high end system which I would overclock and water cool. About a year ago, I dropped a couple thousand dollars on a system which most would consider overkill (not here LOL), but the i7 3770k ran too hot to consider much of an overclock. I had it cooled with a corsair h100i and at idle, temps of 40 degrees was pretty normal, and under load, temps quickly reached 90 degrees at stock settings. I reseated the block to the cpu several times, and even tried the h100i in an old PC of mine to see if it was able to cool it sufficiently, and it did. For the longest time, I thought I must be doing something wrong.

After doing a lot of research on sites like this one, I decided that maybe it was my processor. I bought 2 more fans to set up a push / pull with the h100i, although I needed 8 more of the long screws to mount the second set of fans. Lowes had 1 1/4" 6/32 screws which worked great. I bought a small vise and ordered CLU for my die TIM and Gelid Extreme for my IHS TIM; they had both arrived by yesterday. I went out today to find some sand paper so I could lap my heat sink, but ridiculously, Lowes and Canadian Tire didn't have anything over 600 grit sandpaper. So, I guess the lapping is on hold, but I did delid today. Was nervous, but it all went relatively smoothly.

After it was done, when I booted up, it said that I had installed a new processor and it took me to the bios screen (This also made me nervous as I had not heard of this happening). I just exited and saved and it booted up with no problems. my cores all idle now in the high 20s and low 30s, and after 15 minutes of running Prime 95, my cores were all in the low 50s at stock settings.

Overall, it sounds like a successful delid, although I am not sure I am going to even bother lapping. Overclocking and watercooling next; thanks fellas!

Rylant
post #6 of 6
Glad it worked out for you. Lapping will probably only yield another 3-5 C depending how bowed the IHS is. I'd leave it as is unless that 3-5 c is worth it to you. Haha it was worth it to me but I also lapped my block as well.
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