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delidding and lapping

post #1 of 2
Thread Starter 
Being a complete novice to both of these I have some questions...

When you delid a cpu is the silicon surface a virtual mirror finish? I'm guessing it would be due to the silicon production being really high tec in comparison to the IHS production.

So secondly, if I was to lap a heat sink base to a mirror to go with a de liided cpu would there be any need to use TIM at all?....thinking it may actually inhibit heat transfer compared to having say >95% contact between bare silicon (149 w/m/c) and copper (>400 w/m/c).
post #2 of 2
In theory, yes.
However, you won't get perfect mounting, and in fact have to worry about crushing or "crinkling" the silicon.
So you use TIM.
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