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[Motorola] Motorola's staking a claim on the Phonebloks idea. - Page 6

post #51 of 79
Because man jeans are business casual?
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post #52 of 79
No because man jeans have decent sized pockets.
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post #53 of 79
Quote:
Originally Posted by Supacasey View Post

Even with this design there'll no doubt be tons of problems. One of the biggest I can think of is data transfer. Without soldered connections, performance is going to take a huge hit.

Like PCI Express or processor sockets, right?
   
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post #54 of 79
Quote:
Originally Posted by Artikbot View Post

Like PCI Express or processor sockets, right?

PCI-E and processor sockets exist, right? Then why don't all laptops have extra mini-PCI-E and CPU sockets? rolleyes.gif

The physical space for a mini-PCI slot is like 30-50% the thickness of phone already.
Edited by DuckieHo - 10/30/13 at 1:28pm
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post #55 of 79
Quote:
Originally Posted by DuckieHo View Post

PCI-E and processor sockets exist, right? Then why don't all laptops have extra mini-PCI-E and CPU sockets? rolleyes.gif

Not because of contact connection speed issues.
   
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post #56 of 79
Quote:
Originally Posted by Artikbot View Post

Not because of contact connection speed issues.

They're related. User replaceable components require larger, more robust, and wider tolerances than embedded components.
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post #57 of 79
Quote:
Originally Posted by DuckieHo View Post

They're related. User replaceable components require larger, more robust, and wider tolerances than embedded components.

What about fiber and low frequency light as a means to interconnect certain components? I hear they can send fiber in the terahertz range, maybe it can be applied to certain blocks to overcome various tolerance issues. The metal blocks interconnecting each other could have metal plates on the sides of each block to allow serial communication between blocks. The added surface area on the sides of each block, interconnected this way could 'possibly' allow faster and stabler communications allowing the backplane interconnect for lower frequency applications. I'm sure they'll figure out other 'exotic' alternatives they could add to this system to rectify these issues? Whatever they choose it is could make the phone cheaper or more expensive. I'm choosing the latter...

thumb.gif
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post #58 of 79
Quote:
Originally Posted by chevy106 View Post

What about fiber and low frequency light as a means to interconnect certain components? I hear they can send fiber in the terahertz range, maybe it can be applied to certain blocks to overcome various tolerance issues. The metal blocks interconnecting each other could have metal plates on the sides of each block to allow serial communication between blocks. The added surface area on the sides of each block, interconnected this way could 'possibly' allow faster and stabler communications allowing the backplane interconnect for lower frequency applications. I'm sure they'll figure out other 'exotic' alternatives they could add to this system to rectify these issues? Whatever they choose it is could make the phone cheaper or more expensive. I'm choosing the latter...

thumb.gif

Those have not hit mass production..... if you want a optical connection today, you're looking at a few hundred JUST for the connection.
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post #59 of 79
Come on Samsung, jump in on the idea and really get some steam behind it.
X
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post #60 of 79
Quote:
Originally Posted by DuckieHo View Post

They're related. User replaceable components require larger, more robust, and wider tolerances than embedded components.

They indeed are a factor. But not the largest one.

It's not a connection meant to be fiddled with all day long, either, so not as much mechanical strength is needed compared to say, an USB port. We're already capable of producing extremely small yet accurate and reliable connections... Look at trapezoidal double row socket connectors.

Edit: Couldn't remember the name. Molex SlimStack series board-to-board connections are the ones I am referring to.
Edited by Artikbot - 10/30/13 at 3:26pm
   
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