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[Motorola] Motorola's staking a claim on the Phonebloks idea. - Page 7

post #61 of 79
Well the thing is, even if every major component was socket mounted....at some time those sockets will be updated. I guess it's better than the current system where you really only use a phone for less than a year. What a waste of resources...

Interesting idea though, love to see where they go with it.
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post #62 of 79
Nokia needs to jump on this like a fat kid on a cupcake. Highly modular, nigh-indestructable phones FTW!!!
post #63 of 79
Personally, I don't feel like trading space for modularity.
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post #64 of 79
Quote:
Originally Posted by Sylon View Post

Well the thing is, even if every major component was socket mounted....at some time those sockets will be updated. I guess it's better than the current system where you really only use a phone for less than a year. What a waste of resources...

Interesting idea though, love to see where they go with it.

Unless they plan for forward-compatibility. Look at USB. The only difference between USB 3.0 and 2.0 are a few additional pins that allow more bandwidth and don't impede compatibility with 2.0 devices. The very first SATA devices are still compatible with the newest AMD/Intel/Marvell chipsets and it's lasted for ten years before seeing any indication of being phased out. Even then, I doubt HDDs will move away from SATA III to SATA Express and the latter will be reserved for SSDs. PCIe? Same deal and it's going nowhere soon. If they're like Intel and introduce a new socket every year, then sure, it'll be easier to buy an iPhone/S(whatever). But if they stick around for a decade or more, then your only upgrade will be a new CPU/GPU every few years if you even need it and perhaps more RAM.
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post #65 of 79
Quote:
Originally Posted by Artikbot View Post

They indeed are a factor. But not the largest one.

It's not a connection meant to be fiddled with all day long, either, so not as much mechanical strength is needed compared to say, an USB port. We're already capable of producing extremely small yet accurate and reliable connections... Look at trapezoidal double row socket connectors.

Edit: Couldn't remember the name. Molex SlimStack series board-to-board connections are the ones I am referring to.

It's still 50% thicker than a IC solder on a PCB.

With this you need a IC on a PCB... plugged into a another PCB. You also have to do more trace routing to get the connection point.
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post #66 of 79
Quote:
Originally Posted by DuckieHo View Post

It's still 50% thicker than a IC solder on a PCB.

With this you need a IC on a PCB... plugged into a another PCB. You also have to do more trace routing to get the connection point.

Of course. The challenge becomes designing the universal connection/protocol to interlink the modules with the least amount of connections possible as to free PCB space to route other traces.

But done, it can be.

Thickness increase is the most obvious of the downsides. Honestly, not like it bothers me a lot. I'd rather have a somewhat thick phone that feels solid instead of these current 'paper-made' phones that feel like they'd break apart the moment your jeans stretch.

Already fixed four GS3 due to pocket cracks.
Edited by Artikbot - 10/31/13 at 6:57am
   
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post #67 of 79
Quote:
Originally Posted by adridu59 View Post

Personally, I don't feel like trading space for modularity.

I agree with this; I'd prefer a thinner phone over a modular phone I think.
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post #68 of 79
Quote:
Originally Posted by Artikbot View Post

Of course. The challenge becomes designing the universal connection/protocol to interlink the modules with the least amount of connections possible as to free PCB space to route other traces.

But done, it can be.

Thickness increase is the most obvious of the downsides. Honestly, not like it bothers me a lot. I'd rather have a somewhat thick phone that feels solid instead of these current 'paper-made' phones that feel like they'd break apart the moment your jeans stretch.

Already fixed four GS3 due to pocket cracks.

Virtually anything can be done.... the question for engineers is "what's the budget"?

Modular components increase failure rate, Z-depth, size of components, trace complexity, compatibility, testing/QA, cost..... all for what gain? For mass produced, highly integrated embedded systems.... it's just not worth it making it modular.
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post #69 of 79
I love the idea.. Switching between modules DOES have gain, think about going to work with a bare bones phone, but then using the same phone as a camera during your vacations by attaching a hi res module, then going on a business trip and attaching as much storage as possible for all your data, etc..

But, I do agree that marketing the thing would be difficult, and the problems that it might create by being modular would make the people doubt of it's reliability..
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post #70 of 79
Quote:
Originally Posted by DuckieHo View Post

Virtually anything can be done.... the question for engineers is "what's the budget"?

Modular components increase failure rate, Z-depth, size of components, trace complexity, compatibility, testing/QA, cost..... all for what gain? For mass produced, highly integrated embedded systems.... it's just not worth it making it modular.

The market is there. Now, who will be the adventurous one that will step onto it? We'll see.

I agree that the cost of only developing the base platform and the communication protocols required for the parts to be truly readily swappable is astronomic. Definitely not worth it for low or even mid range devices, but... Think of it, it could extend to other devices as well, not only phones.
   
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