Originally Posted by PostalTwinkie
Originally Posted by Mand12
Source for this?
I had an entire post up with the source links in it, apparently mods felt the need to remove it.
If you Google the topic there are several sources on it, basically SoC has the fab up to the end of Q3, then starting Q4 the PC segment gets in. There was a ~6 week delay with 20nm fab at TSM due to a materials issue, and Apple flipped their lid on TSM. They are back up and running at 100% capacity right now, I believe they are producing ~30K wafers per min, and by June want to be rolling out close to 80K.
Once the fab work for Apple and other mobile is done, end of Q3, we will start seeing production for our segment. Unless something magical happens and they actually ramp up before June and finish early, but that is doubtful given the last delay.
Hey man, where are you getting your numbers, fairy land? The max capacity of the fab I work at is 50k wafers A MONTH
. Nobody, and I mean nobody is making 30k wafers a minute.
Care to read? TSMC all fabs put together 150k 300mm wafers A MONTH http://finance.yahoo.com/news/tsmc-buliding-bumping-capacity-150-111931176.html