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First time help - Will this all work? - Page 4

post #31 of 38
I see that you have room for a 360 rad in the roof and a 120 in the back.
I would put up both of those ....if you can. You can never have too much raddage. Especially if you want to OC in 30° C temps.
And you will want both rads to push air out of your case, with all case fans available pulling air into the case. And if you want dust filters, put that on your case intake fans.

That would be the best air flow design IMHO.

And a backplate really doesn't cool a whole lot. Ir's mainly for looks really.
Edited by PepeLapiu - 3/8/14 at 7:28pm
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post #32 of 38
Thread Starter 
I was thinking about a 120 in the back, I'll decide if I can afford it when I get this, and my GPU comes with a backplate, so I'm not spending more to get one
    
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post #33 of 38
Quote:
Originally Posted by PepeLapiu View Post

I see that you have room for a 360 rad in the roof and a 120 in the back.
I would put up both of those ....if you can. You can never have too much raddage. Especially if you want to OC in 30° C temps.
And you will want both rads to push air out of your case, with all case fans available pulling air into the case. And if you want dust filters, put that on your case intake fans.

That would be the best air flow design IMHO.

And a backplate really doesn't cool a whole lot. Ir's mainly for looks really.

Case air will generally be 4-8C higher temp than ambient air, thereby greatly reducing the cooling efficiency of ya rads.....even Corsair's AIO manual call for using intake air rather than exhaust air for cooling. My interior tamps are 4C hotter than ambient at best (fill 12346 rpm fan speeds) .... with water at 30.4 and air at 22....that means that intake air provides about twice the cooling efficiency on the rads as exhausting.

This link explains the cooling features of the backplate .... note the thermal pad location.

http://www.ekwb.com/shop/EK-IM/EK-IM-3831109868430.pdf

Tho to view it ya may have to view it from the link here

http://www.frozencpu.com/products/21273/ex-blc-1532/EK_ASUS_GeForce_780_GTX_DCII_VGA_Liquid_Cooling_RAM_Backplate_-_Black_CSQ_EK-FC780_GTX_DCII_Backplate_-_Black.html
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post #34 of 38
Thread Starter 
I guess you're right. The front of the case has only a small amount of airflow area, so I'll make the top and back an intake for better airflow and cooling and the front and bottom as an exhaust. lol being a rebel and not following the standards XD
Edited by Wingwire - 3/10/14 at 5:27am
    
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post #35 of 38
Quote:
Originally Posted by Wingwire View Post

I guess you're right. The front of the case has only a small amount of airflow area, so I'll make the top and back an intake for better airflow and cooling and the front and bottom as an exhaust. lol being a rebel and not following the standards XD

Try both ways and see which one you prefer.
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post #36 of 38
Quote:
Originally Posted by JackNaylorPE View Post

Case air will generally be 4-8C higher temp than ambient air, thereby greatly reducing the cooling efficiency of ya rads.....even Corsair's AIO manual call for using intake air rather than exhaust air for cooling. My interior tamps are 4C hotter than ambient at best (fill 12346 rpm fan speeds) .... with water at 30.4 and air at 22....that means that intake air provides about twice the cooling efficiency on the rads as exhausting.

Your case temps will never be that high with water cooling unless you have very bad case air flow.

Rads pulling in and rads pushingout is a toss up. Pulling in will result in slightly higher air cooled components temps, and slightly lower
ater cooled components. And the way around for rads pushing out. Martin agrees with me on this issue on this forum. I'll look that up if you want.

The reason I suggested his rads pushing out is because they are on top.
If they pull in and case fans push out, he will create a bubble of warm air around his case for his rads to suck back in.

OP, just try both ways and see which one you prefer. Not a big deal.
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post #37 of 38
Thread Starter 
Sounds easy enough,
    
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post #38 of 38
Quote:
Originally Posted by PepeLapiu View Post

Your case temps will never be that high with water cooling unless you have very bad case air flow.

Rads pulling in and rads pushingout is a toss up. Pulling in will result in slightly higher air cooled components temps, and slightly lower
ater cooled components. And the way around for rads pushing out. Martin agrees with me on this issue on this forum. I'll look that up if you want.

The reason I suggested his rads pushing out is because they are on top.
If they pull in and case fans push out, he will create a bubble of warm air around his case for his rads to suck back in.

OP, just try both ways and see which one you prefer. Not a big deal.

Remember I do have 6 temp sensors monitoring 4 water temps and 2 air temps so the data is really not in question. If you are using fan speed control to control case temps, to minimize noise you will have your fan curve set up such that speeds are minimized to keep noise to a minimum....the 4-8C is "worse case" as unless I am ramping up to protect something, fan speeds will be set to a minimum. I can do 4C with fans on low...I have seen as much as 8 in other builds.

The rads blowing in produce elevated water temperatures which are in turn passed on to the interior case air...... in addition you have the heat output from pump, rad shrouds, tubing, reservoir, MoBo, GFX Card block and backplate all adding to this. So if your 22c air going in comes out at say 28C, plus all the added heat radiation inside, 4C is not unusual..... But I have 10 fans and 5 more more coming, that is certainly not the norm.....8C will be seen for example with two GFX cards on air and a H110 blowing air into the case (as per the instructions).

You are absolutely correct that having all rad fans blowing in will reduce the ability of case air to air cool interior components but as the amount of heat handled by the rads dwarfs the amount of heat absorbed by the air.....the advantage far far outweighs the disadvantage.

Thermal conductivity at 25c is a 24:1 ratio
http://www.engineeringtoolbox.com/thermal-conductivity-d_429.html

Air = 0.024
Water = 0.58

Yes, we all know that hot air rises but there is a general mindset among many that this somehow overcomes a fan....it doesn't ....as anyone who has ever bought a ceiling fan can attest. I have moved the temp sensor around the case my case and don't find a big swing. A case will function just fine with 0 fans blowing out ..... every single cfm pushed in by the rad fans will certainly get out. Building ventilation is most oft designed this way .... kitchens have air out exhausters .... air does manage to get into the room, usually thru an open make up vent.....attic fans, stores , offices are all designed this way without one "prime mover" providing air in or air out via power and the make up air coming from a vent. Of course, my approach is, if ya have the mount, might as well use it to help things along.
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