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Pounds per square inch on i7 die.

post #1 of 5
Thread Starter 
Hello all,

I obtained employment back into the custom automation field as a controls tech, and I now work with some very talented machinists with every type of high end fabrication and metal working tool you could think of. I have a delidded i7 4770k, and would like to mount my h100i to the die directly. I understand that i will need to make precision standoffs for the h100i to sit on without crushing the die. A few questions about this:

1a) Should I make the standoffs .0001'' (1/1000'') shorter than the die? With something that precise I would think just having a thin layer of Coolaboratory Liquid Ultra would be enough pressure.

1b)How much will the delidded chip sink into the Asus Maximus VI Formula mobo once the cooler is mounted and evenly torqued down?

2)With regards to torque... what foot pounds per square inch should I apply to the mounting screws (evenly). I would think 5 foot pounds would be adequate.

3) Would shaving off 2/1000th's of an inch of the h100's block in a slightly larger shape of the intel die, so that the processor is recessed into the cooler block be feasible? That way I know its dead center.

I am not sure how thick the h100's copper face is.

Thank you for the help.

This is for my htpc. I want to keep a smaller case in the living room. Full custom water is not going to work in my Fractal design r4.
post #2 of 5
I'm going to say that unless there is a REALLY good reason as to making it super perfect, that you are approaching diminishing returns VERY quickly. Unless you want to do it because you can (which is fine), temperatures aren't going to vary by maybe a few C and you could see that variation in how you mount the block to the cpu each time. So unless you really have the desire to pursue this, I would just get some good TIM and throw it on.

Also your questions are VERY specific and I don't know if many people will have the information you are looking for. So you might have to do it yourself and experiment.
post #3 of 5
Thread Starter 
I would think eliminating an extra layer (IHS) that I would allow better heat transfer.
post #4 of 5
Quote:
Originally Posted by Revolvo View Post

I would think eliminating an extra layer (IHS) that I would allow better heat transfer.

Yes but its heat transferring through metal... a few mm wont make much if any difference. As above unless you want to do it for the fun of it, as in try and work out how to do it, then put some good TIM on itand leave it be. The chances are your CPU can probably hit more than 4.4GHz especially if you give it more volts.
post #5 of 5
It would really be marginal at best the gains. But check it out and report back. thumb.gif
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