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Did I fry my 8350?

post #1 of 7
Thread Starter 
Last year, I setup my first custom water loop. Needless to say, it was far from perfect. So, over the past few weeks, I've been gathering up stuff to redo it properly. I finally got around to it last week, but I ran into an interesting little issue. Take a look at my CPU.



At first glance, it looks like some thermal compound gunk leftover, but it's not. I usually remove it with 91% isopropyl alcohol (I'd rather use 99%, but this is all I've been able to find), but it didn't make any difference here. I rubbed it off rather roughly, and even tried soaking it for a few seconds. I know that's generally not recommended, but it was a last resort. It didn't make a lick of difference. Lastly, I tried the two-step Arctic Silver remover/purifier stuff. It didn't have any effect either. The only conclusion I can draw is that this is etched into the lid.

I reinstalled it with some Arcitc Silver 5 compound (pea method application). Before, I'd used Coollaboratory Liquid Ultra. But I think I rushed the application of that. It's possible I might have had some little air bubbles in there that got flattened out when I installed the block. I did notice that at a 5 GHz clock, the CPU temp was pushing 60–62 C. Very unusual for a liquid loop with a 360x360 mm radiator.

I'd like to try overclocking again to see if the new compound fixed it, but I'm a little worried. Everything has been running totally fine at stock for a full week now. But what does this mean? Is that damage exclusively on the lid, while the die itself is fine? How could I tell? I could technically afford to buy a new CPU if I had to, but I'd rather not if I can avoid it. I do want to restore my old overclocks though.
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post #2 of 7
The CPU will be fine. It's not uncommon for some coolers or greases to leave behind scratch marks. Although that is one of the worse ones I have seen. You can look into lapping it, but I wouldn't be concerned.
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post #3 of 7
I guarantee I won't be able to help, but I am curious. Is it residue left on the chip (like cooked on), or is concave - as if the chip is now missing some metal?
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post #4 of 7
Hey,

If you used CLU as your thermal interface compound then those marks could be normal due to the nature of coollaboratory liquid ultra.
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post #5 of 7
Cant really see from the photo but looks like scratch marks from the block vibrating. Should work fine tho.
There no way the chip can get hot enough to make a mark on the outside of the IHS.
post #6 of 7
well, i'd say if the CPU works and stress tests fine at stock, there's no problem. CPU covers are rarely flat at the microscopic level, thus the need for thermal paste, and it wouldn't be unknown for small bits of paste to get trapped in it. Plus you said you used CLU, isn't that stuff solid at room temp, and need heated to 80c-90c to liquidise and flow? If so, whats the chances its just some CLU trapped in some microscopic pits, making it look scratched? I'd bet if you lapped it, it would come off. BUt I don't see the need.

Basically, if you have new paste on, the CPU is cool enough, and passes a stress test, and you're getting no hangs/bluescreens/any other general funkiness, I don't see why you can't try overclocking again. I doubt the die is damaged, it wouldn't boot if it was.
post #7 of 7
Thread Starter 
Thanks for chiming in, guys. I didn't think it was anything too serious, but it can't hurt to ask, right? Now I have noticed some bizarro stability issues here and there, but I'd bet money that's just Windows being Windows. That, and beta drivers combined with crossfire cards, etc. Nothing that can be traced back to the CPU.

I'll give the overclocking another shot. If it bursts into a fireball, I guess we'll know it was more serious than it looks, right? Gosh, I hope the motherboard could survive that. I wouldn't want to have to buy another. This one isn't even on the market anymore. :/
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