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[WCCF]Intel Haswell Refresh – Unlocked Design and Improved TIM - Page 6

post #51 of 125
Quote:
Originally Posted by RagingCain View Post

There is no way he is running 1.5v with Small FFTs (maybe, EXTREMELY unlikely still though, with blend) test without hitting 90c without exotic cooling or freezing ambient.

Please visit here for more information on 3770K: http://www.overclock.net/t/1247869/official-the-ivy-bridge-stable-suicide-club-guides-voltages-temps-bios-templates-inc-spreadsheet/0_50

At the end of the day Haswell and Ivy Bridge are hot, even after all the tricks of the trade. That's fact. A soldered IHS won't fix that. Period.

Ask him, not me.
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post #52 of 125
Quote:
Originally Posted by pengs View Post

Your still without HT and the, be it, small 10-15mV increase needed. Not huge but add 10* on top of that 70* and above room temperature heat, something other than water cooling and your creeping into the high 80's.

Here's the same test done under benchmark conditions with HT:



That's 1.265v - i just didn't have the extra 0.02 from load in the screenshot because i loaded up with cinebench to take the shot with cpu-z info. High 80's not really gonna happen with 0.035vcore more
Edited by Cyro999 - 3/19/14 at 7:54pm
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post #53 of 125

lol "new and improved tim" could simply mean they are changing the tim between the die and heat spreader to something "better".

 

i don't think i'll be upgrading to the refresh if those VRMs are staying on the chip, unnecessary heat.

post #54 of 125
inc no IHS with the refresh, must supply your own TIM lol.
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post #55 of 125
I'll see it when I believe it.
post #56 of 125
Could just be a change of paste and improvement in the gluing process itself, there's such a variety of temps shown across the chips it's ridiculous.
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post #57 of 125
Ignore everything released in between, this is should've been the proper replacement for Sandy biggrin.gif
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post #58 of 125
Quote:
Originally Posted by robE View Post

Depends what they mean with improved TIM....you know, improved is such a relative word smile.gif.

Yeah, could be anything.

However, since they have facilities for soldering, and soldering would be necessary for a substantial improvement, it's not unreasonable to anticipate a switch to solder.
Quote:
Originally Posted by sugarhell View Post

They cant use solder with mainstream Haswell. Chip too small for solder

No it's not.

There is some evidence that soldering smaller dimensions has complications, but parts smaller in every dimension than Haswell have been soldered, and there is nothing that implies that solder is impossible for Intel to do on Haswell.
Quote:
Originally Posted by Alatar View Post

The "real" limit from intel has been that everything that's under 95W TDP uses thermal paste. Until now at least.

There are parts with TDPs lower than 95w that are soldered. All those low power 32nm and older Xeons used solder.
Quote:
Originally Posted by Cyro999 View Post

If you're suggesting worst case synthetic tests, i'd also call that a PEBKAC issue for overclockers

Disagree.

For those that have a reasonable expectation of stability in less than ideal scenarios and don't want to stress test forever, being able to pass the most demanding tests capable of being executed on a part is a must.
Quote:
Originally Posted by RagingCain View Post

At the end of the day Haswell and Ivy Bridge are hot, even after all the tricks of the trade. That's fact. A soldered IHS won't fix that. Period.

This is true, but a soldered IHS and the reduced thermal resistance that comes with it, will mitigate the issue to a degree. It will also make for more durable parts that do not need to be subjected to potentially damaging stresses to get best possible thermal performance.
Quote:
Originally Posted by error-id10t View Post

Could just be a change of paste and improvement in the gluing process itself

Possible.
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post #59 of 125
post #60 of 125
they said "better TIM" not "soldered"

can't they just take that IHS off?
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