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I want this heatsink - Page 6

post #51 of 60
I think the mounting issue could be resolved by using a mounting system that incorporates the motherboard mounting panel.
post #52 of 60
not really seeing how it can support the weight. we are talking about the weight that is maybe 3x the weight of the biggest heatpipe coolers today w/o even taking into consideration of the mechanical advantage of heatpipes that length and the amount of torsional stress that much leverage can have on the mounting point. the only way to relieve that amount of stress is to detach the cooler unit from the CPU plate via a flexible tube. it's how liquid cooling has accomplished the task.
post #53 of 60
Standard mount has approx 60x60mm square area. What I'm suggesting is using the entire area of mobo backing panel to support the cooler. Panel supporting cooler base with mobo & CPU between them. Have a bracket mounted above mobo between panel and cooler pipes.
post #54 of 60
still, it would need to be a fairly thick/stiff plate to overcome the torsional stress w/o bending. which would also add to the cost of the cooler if it were to become a commercially viable product.
post #55 of 60
Commercially viable?
The basic design is not commercially viable as there are not cases that can accommodate it. tongue.gif
post #56 of 60
well, otherwise this is a useless discussion since building a heatpipe based heatsink by hand is... problematic... and insanely expensive as a prototype biggrin.gif would be cheaper to track down a used TNN500AF and machine a CPU plate for the new socket size biggrin.gif in fact, due to the construction of the TNN500AF, it may actually fit the cooler since there is alot of room above the mobo in the 1st place

post #57 of 60
Would love to have a TNN500AF but they are not really practical. TDP of 100w or less. Up to 160w with fan.
The 300 looked good too. thumb.gif
post #58 of 60
Thread Starter 


Updated drawing. Thanks to doyll for calling out the double sided pipe deal.

I went with strict observation of keepout areas and tried to keep pipes as short and vertical as possible.
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exfinium-6
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post #59 of 60
closes unit that was similar in weight was the scythe susanoo. however the length of the pipes add to the leverage/mechanical advantage of the stress. also as doyll has pointed out, there are very few cases on the market today that has the room to support this cooler. so i would recommend you lower the entire unit so that the bottom of the radiator fins is just above the CPU rather then almost 3 inchs above the CPU. remember gravity doesn't really care if you are 1mm above or 5 inches above. it will still draw the liquid downward.
post #60 of 60
Thread Starter 
The radiator is clear of the top of the systemboard to ensure wide compatibility with things like VRM risers and heatsinks.

I'm pragmatic about the chance of this ever being a product but it could easily be done as a new premium case from a manufacturer of both cases and heatpipe coolers. Using a higher performance refrigerant or an optimally designed evaporator cell can potentially put heatpipe cooling clearly ahead the best that ambient water can do. Even with current water-based off-the-shelf-pipe designs, a 240 or 280mm cooler could possibly outperform any ambient water config on the market.

Over to you Coolermaster, Silverstone.
Edited by matman - 4/7/14 at 2:06am
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SanDisk Extreme 240 Samsung HM500JI Corsair H60 Windows 7 
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Dell 3008WFP Dell U2711 Logitech G15 Seasonic S12II 520 
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exfinium-6 Logitech G500 
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