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Why are there so many companies telling you to spread T.I.M lately?

post #1 of 5
Thread Starter 
My friend and i have noticed a massive increase in companies telling you to spread thermal paste. I was lead to believe that spreading is about the worst thing you can do because it creates air bubbles.
I was also told the pea method was the best one and in my experience it is.
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post #2 of 5

I think that they are trying to make sure that people aren't using too much or too little.

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post #3 of 5
Quote:
Originally Posted by TwoCables View Post

I think that they are trying to make sure that people aren't using too much or too little.

Most likely this.
However, I also presume it could be linked to [recent] open-up of various coolers and, respectively, noticing the terribly brushed/uneven contact surface.

Quote:
Originally Posted by philhalo66 View Post

I was lead to believe that spreading is about the worst thing you can do because it creates air bubbles.
I was also told the pea method was the best one and in my experience it is.

Generally, I haven't encountered any issues with the spread method vs pea-drop appliance in terms of performance, and I tend to rely on myself more than dubious pressure. But I guess it is a valid point since the way of spreading the TIM I use differs from the generic splat and rasp.
Edited by fragamemnon - 4/13/14 at 4:38am
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post #4 of 5
I think it depends on the paste. I have to spread my Antec 7 paste, it's way too thick - it wouldn't allow me to seat the heatsink properly if I didn't spread. my artic silver on the other hand is thin enough to use pea method and pressure of heatsink to get good spread.
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post #5 of 5
Thread Starter 
i guess that makes sense
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