Originally Posted by PachAz
It still doesnt matter since the biggest limitation on these chips is the horrible stock thermal paste.
Unless you delid or roll AMD. You make it seam like nothing you do matters because non soldered IHS all get horrible thermals. That's simply not the case and even with it was the point we were making was push/pull means lower noise for the same performance. This is all getting very off topic, the counter point has been stated with references to it's source as with it's explanation and justification.
Originally Posted by SDH500
Back to the res question... with the DB reservoir higher than the 240 reservoir, the fluid level in the 240 will always be as high as its inlet.
Fill the res to the very tip top and then put in the aquapipe. The problem is flexible tubing dries out, except it doesn't because it absorbs water to prevent that. Air can also naturally stay trapped in water. Water can also evaporate far below boiling temp given the right circumstances. I am 98% positive you'll get air trapped in that lower res eventually throughout it's run time. The aqua pipe will inject the intake below the top of the res bypassing the inevitable air buildup.