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intel feedback form , thats right im complaining about the TIM straight to the source

post #1 of 5
Thread Starter 
https://www-ssl.intel.com/content/www/us/en/forms/quality-and-reliability-contact-us.html

they can't ignore us overclockers forever! why unlock the multiplier on the k series cpu's if you're going to put such horrible TIM inside your cpu?!
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Heisenberg
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post #2 of 5
Quote:
Originally Posted by fade2green514 View Post

https://www-ssl.intel.com/content/www/us/en/forms/quality-and-reliability-contact-us.html

they can't ignore us overclockers forever! why unlock the multiplier on the k series cpu's if you're going to put such horrible TIM inside your cpu?!

The intel TIM isn't really the problem, it's as good as most other high end pastes, but the gap between the top of the die & the IHS means there is more of it to transfer heat through.
Delidding is as much about scraping off the black glue between the PCB & IHS, & once under the IHS might as well use the liquid metal TIM which does better than a normal paste.
    
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post #3 of 5
Thread Starter 
i know but its still cooled poorly in any situation. i bought some coollabs liquid ultra for me and my friend to delid ours. do you recommend the vice method or the razor method? ive heard the vice method is safer but idk. razor method seems easier to me just because idk if i can find a vice.
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post #4 of 5
I have done it both ways, the vise method does seem safer seeing the pics of scratched up PCBs from some of the guys, but carefully using the right blades there shouldn't be any issues.

I preferred the vise though, it was faster as well as feeling safer. Either way, just gotta be confident (no shaky hands) & not use more force than necessary whether shoving a blade through the glue or swinging a hammer.
    
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post #5 of 5
Vice method all the way. Blade can easily cut the pcb or traces.
I dont think Intel care too much, you dont have many other options...
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