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Mac Pro Heatsink Core Concept - Page 2

post #11 of 13
Thread Starter 
To confirm I understand what you are saying Doyll.

That it's better for the device attached to the top most heatsink in a stack to run a bit hotter due to the preheating by the heatsink below , than to have one half of both CPU/GPU dies running hotter than the other side of the dies.

If I understood, them it's something I never consider and it just proves why. You are the 'Cooler-Master' ! biggrin.gif

[EDIT] Now that I think of it though, would it not simply mean that the cooler half/warmer half of the dies is just switched between x and the y axis? I'm getting confused again now! redface.gif
Edited by Calibos - 5/22/15 at 3:22pm
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post #12 of 13
Thread Starter 
Re-rendered with the Silverstone Heligion HE01 Heatsinks in an interlocked vertical stack arrangement with 2x 120mm Noctua fans directly mounted in Push/Pull top and bottom of the stack. Heatsink/Fan ducting/Shroud not pictured.

New addition is an idea from a different proposed build. ie. using a server 1U PSU. In this case a 500W seasonic. Fits into unused space at the side of the stack rather than the SFF PSU that would have had to go top or bottom impeding airflow and adding an inch or two to the height.

A single 200mm 147CFM Bitfenix Spectre Pro remains at the top helping those Noctuas get the air through the heatsinks but also serves to pull air up around the sides of the cylinder from the GPU VRMs and mem modules and the mobo chipset heatsinks and ram. I'd also remove the top panel of the 1u PSU and air will be pulled past the internals of that too meaning I can remove the whiny 40mm fans from it.

Diameter back to 250mm and Height down to 315mm.

Thoughts?


Edited by Calibos - 5/22/15 at 7:19pm
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CPUMotherboardGraphicsRAM
6700k Asus Z170-A Palit Super Jetstream GTX1080 16GB Corsair Dominator Platinum 3200mhz 
Hard DriveHard DriveHard DriveCooling
500GB Samsung 840 Evo SSD 3TB Toshiba 7200 RPM 3 TB Toshiba 7200 RPM Corsair H110i GT AIO Cooler 
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2 TB - WD20EARX 128gb Crucial M4 SSD Samsung Blu-Ray Corsair H100 
OSMonitorKeyboardPower
Windows 7 Home Premium 64bit Dell 24" 2405 Saitek Eclipse Corsair HX1050 
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Corsair Graphite 600T Logitech M500 Gaming Mouse Integrated 
CPUMotherboardGraphicsRAM
6700k Asus Z170-A Palit Super Jetstream GTX1080 16GB Corsair Dominator Platinum 3200mhz 
Hard DriveHard DriveHard DriveCooling
500GB Samsung 840 Evo SSD 3TB Toshiba 7200 RPM 3 TB Toshiba 7200 RPM Corsair H110i GT AIO Cooler 
OSMonitorKeyboardPower
Windows 10 Pro 64bit LG 34UC98 34" 21:9 Ultrawide Corsair Strafe RGB Corsair RM750x 
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Corsair Air 540 Corsair M65 Pro Corsair 900mmx300mm Onboard 
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post #13 of 13
Quote:
Originally Posted by Calibos View Post

To confirm I understand what you are saying Doyll.

That it's better for the device attached to the top most heatsink in a stack to run a bit hotter due to the preheating by the heatsink below , than to have one half of both CPU/GPU dies running hotter than the other side of the dies.

If I understood, them it's something I never consider and it just proves why. You are the 'Cooler-Master' ! biggrin.gif

[EDIT] Now that I think of it though, would it not simply mean that the cooler half/warmer half of the dies is just switched between x and the y axis? I'm getting confused again now! redface.gif

When the heatpipes in fin pack are aligned with airflow the cooling ability gets progressively lower as air cools each pipe and get warmer the farther / more pipes it flows past .. resulting in the base being cooler on side closest to air source.

When the heatpipes in fin pack are aligned across the airflow they all get the same airflow temp and cooling Each successive layer of pipe gets less cooling, but the heatpipe base is evenly cooled.

How much difference it makes I do not know.

I do know that many cooler bases work better in one orientation than another, but it is because of pipe alignment over CPU chip, not airflow.
Reason is rather obvious. Orientation determines the proximity and area of evaporation area of pipe over chip .. which is why coolers with less pipes can cool as well as with more pipes. Silver Arrow SB-E, IB-E and Silver Arrow ITX are good example of this on most CPUs. All use same fin pacs and all perform near identical, but SB-E & IB-E have 8 pipes while ITX has 6. The 2 outer pipes on the 8-pipe coolers are too far from chip to draw much (if any) heat from CPU .. especially the smaller / square-ish chips.

Edited by doyll - 5/23/15 at 5:04am
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