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post #751 of 821
Quote:
Originally Posted by bluej511 View Post

It does but its a possibility that they grind down the ihs a few thousands of a mm so they can reseal it. Wouldnt even take long on a flat grinder. Its been proven thats the issue though. They could chime in id love to know haha.

Wait dont they use CLU between the die and ihs anyways?

When we seal the lid back on, we use a lot of pressure so there's no gap between the CPU die and IHS. This is in contrast to the thick layer Intel applies.

And to those wondering what to use, silicone gasket maker works great: http://www.amazon.com/gp/aw/d/B0002UEN1U/ref=sxl1?qid=1465183647&sr=1&pi=AC_SX236_SY340_FMwebp_QL65
post #752 of 821
Quote:
Originally Posted by Silicon Lottery View Post

When we seal the lid back on, we use a lot of pressure so there's no gap between the CPU die and IHS. This is in contrast to the thick layer Intel applies.

And to those wondering what to use, silicone gasket maker works great: http://www.amazon.com/gp/aw/d/B0002UEN1U/ref=sxl1?qid=1465183647&sr=1&pi=AC_SX236_SY340_FMwebp_QL65

Yea i thought it was something of that sort. I also saw the delid service you offer its why i figured a combination of the two. For me doing from CLU and IHS to bare die and IHS i dropped 4-5°C at least so its fantastic. What it ran CLU/IHS at 1.2v is 3°C cooler then running bare die at 1.3v so i don't mind at all.
    
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post #753 of 821
Alright well, I just cut a little notch on the top of the IHS w/a grinder to ensure airflow from the rapid heating/cooling of the CPU. I used a strip of cut masking tape at the top and bottom as well to ensure that the IHS wasn't going to rub on installation, and that the notch wouldn't grind into the PCB even though I made it smooth. There was no gap created by the 1 strip of cut down packing tape I saw some posts about cracking die's on Skylake processors from delidding and cleaning the old glue off. With the tiny breather hole, this won't be a problem. Results are -. 4.6Ghz 1.35v is now below 60C, before I would hit 83C in OCCT. I saw best results with Liquid Pro, +2-3C from Liquid Ultra. I can pass OCCT w/1.3v however Realbench required 1.34 to pass 8 hrs, I just bumped to 1.35 to be bombproof.

post #754 of 821
Quote:
Originally Posted by TyrantTru View Post

Alright well, I just cut a little notch on the top of the IHS w/a grinder to ensure airflow from the rapid heating/cooling of the CPU. I used a strip of cut masking tape at the top and bottom as well to ensure that the IHS wasn't going to rub on installation, and that the notch wouldn't grind into the PCB even though I made it smooth. There was no gap created by the 1 strip of cut down packing tape I saw some posts about cracking die's on Skylake processors from delidding and cleaning the old glue off. With the tiny breather hole, this won't be a problem. Results are -. 4.6Ghz 1.35v is now below 60C, before I would hit 83C in OCCT. I saw best results with Liquid Pro, +2-3C from Liquid Ultra. I can pass OCCT w/1.3v however Realbench required 1.34 to pass 8 hrs, I just bumped to 1.35 to be bombproof.


Good work. You should make two holes. If you can, in opposite direction. Because the hot air work like a liquid and try to get out of the room. Doing to holes the movement of the hot air produce one hole when the air is out and other where fresh air is going in. I think in this way you can get the maximum of this chip.

Regards!
post #755 of 821
Quote:
Originally Posted by nyxz View Post

I would like to reseal mine, which silicone glue should I use? anyone who used one? wouldn't mind a recommendation.

Buy 100% Black Silicon. Resist -40 to 200 Celsius Degrees. No problem to stay there. Before you try again with you processor, let the chip dry for one day. (poor space inside the chip to dry. So it´s slowly.
post #756 of 821
Not sure about this suggestion, it doesn't really need to breathe.. just needs to not be sealed. My temps are fantastic now though. I'm under 60C in OCCT at 4.6 1.35v on AIO
post #757 of 821
Well I took the plunge this morning with i5 6600k and delidded it with the razer blade method. Talk about a bit of nerve wracking one wing on the IHS just did not seem to want to cut. Anyhow after I got that done not sure if I cleaned it well enough as I all had was 91% Isopropyl Alcohol some of that silicon sealant/glue just does not want to come off.

Put it back in my system but only got a few degree drop in temps but this is due I think to only having MX-4 and AS-5 paste on hand tried both. The AS-5 seems a bit better but needs cure and cycling time. I just ordered CLU.

I have not done full stability testing yet but seems I am able to hit Core 4.9 Mhz Ring 4.7Mhz with the SA at 1Mhz but had to up my voltage as I went from 4.8 to 4.9 Max temps with this thermal past has been low 70's with 1.45 volts.

Idle temps are staying right at ambient for me. Prior to delidding my idle temps were 5 - 6 degrees above ambient. ( I know idle temps really do not matter) My cooler is Corsair H110GT The IHS is floating.

I did not take any pictures of me delidding as I was too nervous about the delidding.
Edited by mtrai - 6/23/16 at 9:49am
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post #758 of 821
Quote:
Originally Posted by mtrai View Post

Well I took the plunge this morning with i5 6600k and delidded it with the razer blade method. Talk about a bit of nerve wracking one wing on the IHS just did not seem to want to cut. Anyhow after I got that done not sure if I cleaned it well enough as I all had was 91% Isopropyl Alcohol some of that silicon sealant/glue just does not want to come off.

Put it back in my system but only got a few degree drop in temps but this is due I think to only having MX-4 and AS-5 paste on hand tried both. The AS-5 seems a bit better but needs cure and cycling time. I just ordered CLU.

I have not done full stability testing yet but seems I am able to hit Core 4.9 Mhz Ring 4.7Mhz with the SA at 1Mhz but had to up my voltage as I went from 4.8 to 4.9 Max temps with this thermal past has been low 70's with 1.45 volts.

Idle temps are staying right at ambient for me. My cooler is Corsair H110GT The IHS is floating.

I did not take any pictures of me delidding as I was too nervous about the delidding.

Your temps will get worse having TIM on the die, it doesnt seem to last long even with curing.
    
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post #759 of 821
Quote:
Originally Posted by bluej511 View Post

Your temps will get worse having TIM on the die, it doesnt seem to last long even with curing.

Like I said I just ordered some CLU so it will be here in a few days and can redo all that. I had to use what I had on hand.
Intel 6600k
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Intel 6600k
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post #760 of 821
how good is liquid ultra long term durability? lets say after 5 years?
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