Originally Posted by Praz
The amp values are for total processor processor current draw. Package temperature is an average of the highest reporting sensor. That sensor
may or may not be one that is visible to monitoring software.
Yeah, we got what PKg temp is. If I understand you correctly: the higher current-induced temperature increase, if there is one, may not be specifically visible to monitoring software, but would be included in the sensors rolled into Package temp? Yep - I'm confused. .
werm, for clarity... the increase current experienced with higher ram clocks (like 3400) may or may not show up as a higher package temp
assuming we're only monitoring this with software.
Originally Posted by djgar
Sure that's not a coffee pot in the bubble wrap?
I love my M8A, no longer available. Got it just in time.
lol - padding during assembly... I have to make a rubber grommet to go around the 3.5" cutout.
but it should look like an old perk coffee pot.
Originally Posted by sexpot
Nice JP! I have the S8S version (S8S
tumpy) of the S8 case and had to do the exact same cut to the mid plate! I too also notice high package temps. It may be due to the psu heating up the lower chamber as there's no where for the hot air to exhaust. I wish they stamped the back panel of the PSU chamber the same way they did above the PCIe slots.
hey - did you have to make the cutout for the res or did that model offer a mid panel with the cutout?Edited by Jpmboy - 9/1/16 at 1:45pm