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Skylake Overclocking Guide [With Statistics] - Page 564

post #5631 of 11309
Yes and there also has been a ton of videos that prove if you use too much paste at the worst you will only lose 2 degrees. So too much is always better than too little. For those that seem to think too much paste acts as an insulator I'll be happy to link you to sever sites that will prove otherwise.
post #5632 of 11309
Quote:
Originally Posted by Bogga View Post

This have been talked about since forever. If you're using "ordinary" thermal paste then the method of how you apply it seems to not matter at all. At least not in any of the videos I've seen.

It might not but in trying to eliminate TIM out of the equation (of abnormal high temps) it is better to suggest the pea method, so I agree with superkyle1721.
    
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post #5633 of 11309
Quote:
Originally Posted by LostParticle View Post

It might not but in trying to eliminate TIM out of the equation (of abnormal high temps) it is better to suggest the pea method, so I agree with superkyle1721.


here is a good post that I show people who disagree. Is there a difference sure but not very much and my god look at how much he used haha

http://forums.anandtech.com/showpost.php?p=34308193&postcount=101
post #5634 of 11309
For this of you running the stress test in prime 95 28.7 are you running small fft? I'm at 4.8ghz and have been for about a day and a half of gaming etc and haven't had a single problem. As soon as I run prime it crashes. I'm going to up the voltage and try again but just wanted to know if I'm doing it correctly.


Always destroying exergy!!
post #5635 of 11309
Quote:
Originally Posted by alphadecay View Post

llantant, I believe that Darkwizzie recommends 4.4 @ 1.35V as a starting point in the guide, and this load voltage for 4.5 matches Anandtech's voltage when they tested the Z170-A. So 4.5 @ 1.344 seems okay to me.

I'll probably test to lower voltage or push clocks higher, but I wanted to establish a baseline that I know I can reliably run for my needs.

Ok that's fine.
I still think 1.35 is a little high for 4.5 though. Just my opinion.

Again I would not use auto llc either.
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post #5636 of 11309
In my testing so far I have found that auto basically sets itself to level 1 which will apply additional voltage to the core then commanded in bios. Level 2 however is what I am currently using and seems to be very close to the commanded bios voltage.


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post #5637 of 11309
Quote:
Originally Posted by LostParticle View Post

It might not but in trying to eliminate TIM out of the equation (of abnormal high temps) it is better to suggest the pea method, so I agree with superkyle1721.

Never said I was correct and I used the pea method earlier. But after I saw how the skylake looks like beneath the ips isn't the line method the best way if there is one that's the best?
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post #5638 of 11309
Quote:
Originally Posted by Bogga View Post

Never said I was correct and I used the pea method earlier. But after I saw how the skylake looks like beneath the ips isn't the line method the best way if there is one that's the best?

Well, my personal and subjective opinion is that the best method is the one each individual has mastered. I have been using the pea method since for ever and I always had / have great results. But a good friend of mine who has mastered the skill of spreading the TIM has equally great results. So, whatever each one can perform better. The pea method is the simplest, I believe, this is why it is generally recommended. And by the way, I do not own / use a Skylake processor, as can be seen from my sig_rig.

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post #5639 of 11309
Quote:
Originally Posted by Bogga View Post

Quote:
Originally Posted by LostParticle View Post

It might not but in trying to eliminate TIM out of the equation (of abnormal high temps) it is better to suggest the pea method, so I agree with superkyle1721.

Never said I was correct and I used the pea method earlier. But after I saw how the skylake looks like beneath the ips isn't the line method the best way if there is one that's the best?

As said above each method is subjective. Although there is a lot of testing done. (I'll see if I can find the site) Either way basically what it tests are the spread method, Multi dot method, pea method, double line method, x method, and a couple others I can't remember. Each method was pasted 5 times to take an average to help eliminate a bad paste job. The difference in temps never reached more than 5 degrees no matter the method. The worst method was the multi dot method and the best was the cross or X method. The pea method was around .1-.4 degrees warmer but is easier to do so it was still the recommended method.

What is much more important than the method used to paste is the mounting of the heat sink itself. When mounting ensure that once contact is made between the sink and the IHS that the sink never rises up again. If it does this will introduce air pockets in the paste. Air does act as an insulator and will raise temps a good bit (usually seen only on 1-2 cores).

If you are really interested in experimenting with all this I would suggest buying the cheapest crappiest non abrasive paste you can fine and spend the day wasting it all. Find out what works best for you on the cheap paste then use a high end paste for the final seating.


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post #5640 of 11309
Quote:
Originally Posted by superkyle1721 View Post

For this of you running the stress test in prime 95 28.7 are you running small fft? I'm at 4.8ghz and have been for about a day and a half of gaming etc and haven't had a single problem. As soon as I run prime it crashes. I'm going to up the voltage and try again but just wanted to know if I'm doing it correctly.

Same for me. Not as soon as I launch, but certain Prime tests will require more voltage to run stably than does gaming. I'll run what is necessary for the purposes of this thread, but day to day, I'll back down to whatever is stable for my purposes. Or maybe I'll just use x264.
Quote:
Originally Posted by superkyle1721 View Post

What is much more important than the method used to paste is the mounting of the heat sink itself. When mounting ensure that once contact is made between the sink and the IHS that the sink never rises up again. If it does this will introduce air pockets in the paste. Air does act as an insulator and will raise temps a good bit (usually seen only on 1-2 cores).

Yes, that is also very important.

I always recommend the pea method because it is the easiest with which to get good, reliable results. In Prime95 28.7, small fft, I get temps in the low 70s.
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