Originally Posted by Bogga
Originally Posted by LostParticle
not but in trying to eliminate TIM out of the equation (of abnormal high temps) it is better to suggest the pea method, so I agree with superkyle1721.
Never said I was correct and I used the pea method earlier. But after I saw how the skylake looks like beneath the ips isn't the line method the best way if there is one that's the best?
As said above each method is subjective. Although there is a lot of testing done. (I'll see if I can find the site) Either way basically what it tests are the spread method, Multi dot method, pea method, double line method, x method, and a couple others I can't remember. Each method was pasted 5 times to take an average to help eliminate a bad paste job. The difference in temps never reached more than 5 degrees no matter the method. The worst method was the multi dot method and the best was the cross or X method. The pea method was around .1-.4 degrees warmer but is easier to do so it was still the recommended method.
What is much more important than the method used to paste is the mounting of the heat sink itself. When mounting ensure that once contact is made between the sink and the IHS that the sink never rises up again. If it does this will introduce air pockets in the paste. Air does act as an insulator and will raise temps a good bit (usually seen only on 1-2 cores).
If you are really interested in experimenting with all this I would suggest buying the cheapest crappiest non abrasive paste you can fine and spend the day wasting it all. Find out what works best for you on the cheap paste then use a high end paste for the final seating.
Always destroying exergy!!