VRM temps where hitting 109c and throttling the CPU. Disassembled and removed the heatsink. I replaced the thermal pad with a 1mm thick fujipoly 11.0 W/mK. The factory heatsink was really only applying pressure to the end most moduels due to the PCB warping. As you can see there are deep endentations on the ends of the heatsink thermal pad but barely any contact in the middle. To resolve this issue i created a back plate to sadwich the pcb and modules. I also figured since a lot of the heat is transfered into the pcb and the mobo actually gets quite hot in this area that i would use more 11.0 W/mK thermal pad on the mobo and a heatsink attached to the backing plate with arctic silver alumina thermal adhesive.
The results are temps staying below 95c with the side panel on and 68c with the panel off and a noctua 92mm fan blowing on the rear heatsink/cpu socket. No throttling anymore even at 95c.
Im still on the fence about cutting a hole in the panel to mount the noctua fan for a filtered intake over the rear heatsink. This does have a dramatic effect on cooling the vrm and cpu socket however im not running into any throttling as is and the vrms only really hit 70c when gaming with the panel on. I dont do any other CPU intensive tasks really.