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[TPU] Samsung Announces the 950 PRO Consumer M.2 PCIe SSD - Page 29

post #281 of 438
Quote:
Originally Posted by carlhil2 View Post

Well, the arrival of the Pro has brought the price of the intel 750 down, too late for me though...still

Where are you seeing a price drop? They all look the same to me.

https://pcpartpicker.com/part/intel-internal-hard-drive-ssdpedmw400g4r5
https://pcpartpicker.com/part/intel-internal-hard-drive-ssdpedmw800g4x1
post #282 of 438
Quote:
Originally Posted by Metros View Post

What temperature do you think this will get to if you put games on the 950 Pro and play it from the SSD or installing new games onto it.

Not hot enough to need cooling and probably not hot enough to throttle.
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post #283 of 438
Quote:
Originally Posted by Seyumi View Post

I found out the hard way I couldn't use a Samsung SM951a NVME on my Asus Rampage V Extreme with 4 Titan X's. Buyer beware. I would have loved this one especially with all all-black pcb. First world problems frown.gif

Has high end parts, complains about the colors

First world problems

(psst give them to me if you don't like them)
post #284 of 438
Quote:
Originally Posted by Blameless View Post

Thermal pads aren't awkward and won't block the slot.

If for some reason you are adverse to them and you have any clearance what so ever, you can use a heatsink.

A thermal pad has to make contact with another surface to transfer heat. What is this surface in your example?

You also need to hold down a thermal pad or heatsink, using glue like thermal paste, which is messy, or pressure, which can crack the pcb.
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post #285 of 438
Quote:
Originally Posted by Armxnian View Post

A thermal pad has to make contact with another surface to transfer heat. What is this surface in your example?

You also need to hold down a thermal pad or heatsink, using glue like thermal paste, which is messy, or pressure, which can crack the pcb.

You simply put it between the motherboard PCB and the bottom of the drive PCB and use the motherboard as the heatsink. There is so little heat generated that all you need is something slightly better than air. No need for high pressure or anything because we don't need optimal heat transfer.

The reason the controller gets hot is not because it generates a lot of heat but because there is literally no mechanism for thermal transfer, besides air, from the bare chip package.

edit:
deltaT = ( watts * thickness in m ) / (area in m² * thermal conductivity in W/mK)

Some back of the envelope calculations assuming max power for the 950 Pro and 2 cm² of 3 mm thick thermal pad with 5W/mK conductivity:

( 6.4W * 0.003 m) / ( 0.0002 m² * 5 W/mK ) = 19.2 °C over ambient.
Edited by Asmodian - 10/27/15 at 12:40pm
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post #286 of 438
Quote:
Originally Posted by cmpxchg8b View Post

Sorry for offtopic - how did you connect SLI bridges like that?

Two of the SLI block connectors are dummies - I hollowed them out and they fit over the blank plugs, they are trapped in place by the real block beside each one and one set of screws.
post #287 of 438
Quote:
Originally Posted by Asmodian View Post

You simply put it between the motherboard PCB and the bottom of the drive PCB and use the motherboard as the heatsink. There is so little heat generated that all you need is something slightly better than air. No need for high pressure or anything because we don't need optimal heat transfer.

The reason the controller gets hot is not because it generates a lot of heat but because there is literally no mechanism for thermal transfer, besides air, from the bare chip package.

There are components between the motherboard and the drive. Uneven surface. There is basically no contact if you put a thermal pad. If there is, then the components are absorbing the heat. 6 watts is a lot of power for a small capacitor to dissipate.

It's a stupid design for desktop use. You shouldn't need to jury-rig an ssd so it performs.
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post #288 of 438
Quote:
Originally Posted by Armxnian View Post

There are components between the motherboard and the drive. Uneven surface. There is basically no contact if you put a thermal pad. If there is, then the components are absorbing the heat. 6 watts is a lot of power for a small capacitor to dissipate.

It's a stupid design for desktop use. You shouldn't need to jury-rig an ssd so it performs.

Someone did exactly this with the 951 and posted pictures and how it works earlier in this thread (I think it was this one). It worked perfectly and nothing on the motherboard heated up noticeably. The unevenness is why you use thermal pads, one capacitor doesn't get all 6 W. rolleyes.gif

True, it might have been better for desktop use if the 950 Pro had some sort of heat spreader or something for thermal management but then it probably wouldn't fit in some mobile devices.

A normal 2.5" SSD, but using SFF-8639, would be great and I hope to see the next "850 Pro" type drive using SFF-8639. M.2 will have to hold us over until then. Oh, and my motherboard doesn't support SFF-8639. tongue.gif

This is a better option than a heatsink or water cooling (lol) and it doesn't need anything complicated or permanently modified.
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post #289 of 438
Quote:
Originally Posted by Asmodian View Post

Someone did exactly this with the 951 and posted pictures and how it works earlier in this thread (I think it was this one). It worked perfectly and nothing on the motherboard heated up noticeably. The unevenness is why you use thermal pads, one capacitor doesn't get all 6 W. rolleyes.gif

True, it might have been better for desktop use if the 950 Pro had some sort of heat spreader or something for thermal management but then it probably wouldn't fit in some mobile devices.

A normal 2.5" SSD, but using SFF-8639, would be great and I hope to see the next "850 Pro" type drive using SFF-8639. M.2 will have to hold us over until then. Oh, and my motherboard doesn't support SFF-8639. tongue.gif

This is a better option than a heatsink or water cooling (lol) and it doesn't need anything complicated or permanently modified.

The tallest component under the drive will be the only component that gets contact with the pad if there is no pressure. It might have worked with that specific motherboard, doesn't mean it will with all.

Secondly, my board for example, the x99 sabertooth, has thermal armor. This offsets the slot by quite a bit. If I put a thermal pad under a drive, it will be bent 30 degrees upward. I'm currently using the asus m.2 hyper kit for my 750. The screw is really short and required unimaginable force to get it into the threads. Would be impossible with a pad under.
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post #290 of 438
Quote:
Originally Posted by Armxnian View Post

The tallest component under the drive will be the only component that gets contact with the pad if there is no pressure. It might have worked with that specific motherboard, doesn't mean it will with all.

Secondly, my board for example, the x99 sabertooth, has thermal armor. This offsets the slot by quite a bit. If I put a thermal pad under a drive, it will be bent 30 degrees upward. I'm currently using the asus m.2 hyper kit for my 750. The screw is really short and required unimaginable force to get it into the threads. Would be impossible with a pad under.

Ah, yes I am sure there are many situations where this wouldn't work (vertical M.2 slots like on the X99 Deluxe too). I am happy my board is pretty bare under the M.2 position and I will cut out a hole in the thermal pad if there are any lone tall components.

You will have to use a double sided tape style thermal pad and a small heatsink, or just stick with the 750 as this isn't much of an upgrade. wink.gif

I do wonder why Samsung hasn't released a SFF-8639 version of this drive; I bet something similar is coming soon. For me no wires is worth messing with thermal pads but options are always good.
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