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How long does paste last in delid? Thoughts on leaving IHS off....

post #1 of 16
Thread Starter 
So my question is how long does the paste last when delidded? I know most high end thermal paste starts to deteriorate in 6-12 months and needs repasting when at extreme overclocks. I know I even saw ICD start to show several C increase after 3 months and needed a repaste after 6 months. Granted I ran 85-90C 24/7 on F@H so I was running hot. That was partly why I dived into Heat-Spring. Mx-4 was crap and needed monthly repaste. I got a large tube hardly touched because that stuff was crap. These were laptops though so heatsinks weren't the highest quality in levelness.

Anyone have experience of max load like F@H on these delidded chips and notice a temp change over time? I plan on using these 6700K in a server and my desktop, where high load 24/7 is a guarantee.

I was debating on leaving the IHS off and running the chip like a laptop since I have a lot of experience in that. Anyone try that? I practically only know laptops now from messing around with a 720qm, 920xm, 3720qm, 3920xm, and some other low end bare chips.

Any sources and advise is appreciated. I tend to be excessive methodological so details and not hearsay please. If anyone recalls the insanity i tried to pull off with testing HS will know. I spent months working on that and project creep killed me lol. I had like 80 hours of testing (not counting months of planning) and realized i missed a crucial point in analysis and had to scrape the whole project :/ I am excessively detailed so please sources to people that have tried bare bound die would be appreciated greatly. I don't want to be the guinea pig in this ^-^
Edited by HOPELESSLYFAITH - 9/29/15 at 4:51am
post #2 of 16
CLU should last until you mess with it. It's 100% metal.
Don't leave the spreader off because your temps won't be much better, the paste won't last any longer and you have to remove the socket mechanism to do so.

http://www.newegg.com/Product/Product.aspx?Item=9SIA85V3985865&ignorebbr=1

smile.gif
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post #3 of 16
Thread Starter 
I was debating at giving my last 2 samples of Heat-Spring another try. With Heat Spring ti never has to be replaced because it is a shim. Was going to try that other indium bimouth stuff too.
post #4 of 16
I have a 3770K that has had CLU under the IHS for nearly 3 years now. Temperatures are within 1-2C of what they were on day one.

As for leaving the lid off and going direct die, I would not recommend it. There is a high chance of damage due to how thin the PCB is on Skylake. Any pressure causes the PCB to bend, which can also cause post problems due to pins not making good contact. The post here outlines some details: http://www.overclock.net/t/1568357/skylake-delidded/440#post_24447763
post #5 of 16
Thread Starter 
Quote:
Originally Posted by Silicon Lottery View Post

I have a 3770K that has had CLU under the IHS for nearly 3 years now. Temperatures are within 1-2C of what they were on day one.

As for leaving the lid off and going direct die, I would not recommend it. There is a high chance of damage due to how thin the PCB is on Skylake. Any pressure causes the PCB to bend, which can also cause post problems due to pins not making good contact. The post here outlines some details: http://www.overclock.net/t/1568357/skylake-delidded/440#post_24447763
are the laptop chips made differently? How is it different from a laptop version? (obviously not out yet but you get what i mean..or is it?)
post #6 of 16
Quote:
Originally Posted by HOPELESSLYFAITH View Post

So my question is how long does the paste last when delidded? I know most high end thermal paste starts to deteriorate in 6-12 months and needs repasting when at extreme overclocks. I know I even saw ICD start to show several C increase after 3 months and needed a repaste after 6 months.

Depends on the specific TIM.

Some stuff will last pretty much forever, others start to pump out or degrade in a few months. In general, the higher the viscosity and the fewer the metallic components, the longer it will last.
Quote:
Originally Posted by HOPELESSLYFAITH View Post

are the laptop chips made differently? How is it different from a laptop version? (obviously not out yet but you get what i mean..or is it?)

Mobile Skylake is FCBGA, so yes, very different packaging design.
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post #7 of 16
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Quote:
Originally Posted by Blameless View Post

Depends on the specific TIM.

Some stuff will last pretty much forever, others start to pump out or degrade in a few months. In general, the higher the viscosity and the fewer the metallic components, the longer it will last.
Mobile Skylake is FCBGA, so yes, very different packaging design.

he is referring to the PCB being thinner. Is it skylake wide or only desktops for some odd reason. I know its a different package...doesn't mean the PCB is the same or different.
post #8 of 16
Quote:
Originally Posted by Silicon Lottery View Post

I have a 3770K that has had CLU under the IHS for nearly 3 years now. Temperatures are within 1-2C of what they were on day one.

I had CLU on my under IHS delid for about a year and it was as fresh as day one. But the CLU I had on my IHS to waterblock tho was hard as a rock and needed to use the scotch brite like sanding pad they give you to be removed for a reseating. Not sure what was up with that but thats my 2cents.gif

It took the nice mirror finish off my 240x mad.gif. O well it was cosmetic and I am to lazy to relap it.
post #9 of 16
Thread Starter 
Quote:
Originally Posted by phenom01 View Post

I had CLU on my under IHS delid for about a year and it was as fresh as day one. But the CLU I had on my IHS to waterblock tho was hard as a rock and needed to use the scotch brite like sanding pad they give you to be removed for a reseating. Not sure what was up with that but thats my 2cents.gif

It took the nice mirror finish off my 240x mad.gif. O well it was cosmetic and I am to lazy to relap it.

I got 3k 5k 8k sanding paper on hand for heatsinks biggrin.gif but sanding requires insane amount of care because you can't make the surface uneven. I spent weeks trying to figure out a way to do it on laptops HSs and it is impossible unless you have some special tools that can guarantee a perfectly level surface and even pressure.

if you care search for jewelry polishing paper/cloth that is where you can find 5 and 8k paper even like 40k but that really is pointless. 5k and 8k are fine. if not over kill. I have used 3k automotive paper with success too.
post #10 of 16
Quote:
Originally Posted by HOPELESSLYFAITH View Post

are the laptop chips made differently? How is it different from a laptop version? (obviously not out yet but you get what i mean..or is it?)

The laptop CPUs are soldered to the motherboard afaik, so the PCB wouldn't be able to bend at all.
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