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Asus Z10PE D16 WS Owners Thread - Page 39

post #381 of 420
Quote:
Originally Posted by cekim View Post

I don't have the answer I wish I did here (specifically, I'm not sure what the NUMA settings in the ASROCK dual C612 MB actually do, but their their addition brought my ASROCK EPC612 2x2696 system up to the same performance as my ASUS Z10PE 2x2696 system (i.e. prior to enabling bios-level NUMA settings, the Asrock was slower, so it did "something").

Have you looked in the Asus BIOS to see if there is anything you are not enabling there?

I have but the AUTO and default settings all seem perfectly ok, and wouldn't have caused the problems we've seen. As I say, we now know for sure that the cause is the non NUMA-aware code in those libs, because removing them sees processor load increase.

I also used the BCDEDIT tool to experiment with different group sizes, and check my original (default) setup, which is correct. I know this because our code that doesn't use the 'bad' libs we bought, uses every available logical processor, so we typically see 98/99% across all processors when those sims are running. The NUMA settings allow you to define logical processors into groups, and manage process affinity with them. My problem stems from some bought-in libraries we used in our code not being aware of NUMA groups. This inevitably means that because they can see only one group, they can never make full us of all the logical processors. Here's some links that describes this better than I do:
https://msdn.microsoft.com/en-us/library/windows/hardware/ff542202(v=vs.85).aspx
https://msdn.microsoft.com/en-us/library/dd405503(VS.85).aspx
https://msdn.microsoft.com/en-us/library/ms684251(v=vs.85).aspx
https://msdn.microsoft.com/en-us/library/aa363804(v=vs.85).aspx
post #382 of 420
Quote:
Originally Posted by slobbydog View Post

I have but the AUTO and default settings all seem perfectly ok, and wouldn't have caused the problems we've seen. As I say, we now know for sure that the cause is the non NUMA-aware code in those libs, because removing them sees processor load increase.

I also used the BCDEDIT tool to experiment with different group sizes, and check my original (default) setup, which is correct. I know this because our code that doesn't use the 'bad' libs we bought, uses every available logical processor, so we typically see 98/99% across all processors when those sims are running. The NUMA settings allow you to define logical processors into groups, and manage process affinity with them. My problem stems from some bought-in libraries we used in our code not being aware of NUMA groups. This inevitably means that because they can see only one group, they can never make full us of all the logical processors. Here's some links that describes this better than I do:
https://msdn.microsoft.com/en-us/library/windows/hardware/ff542202(v=vs.85).aspx
https://msdn.microsoft.com/en-us/library/dd405503(VS.85).aspx
https://msdn.microsoft.com/en-us/library/ms684251(v=vs.85).aspx
https://msdn.microsoft.com/en-us/library/aa363804(v=vs.85).aspx
Yeah, as I said, I've been fortunate so far that I haven't had to delve very far into this under linux and with the software I am dealing with (or at least I have no comparison which has fostered the need for delving further).

I fully understand the architectural issue, just not the details of what the BIOS is actually doing on the Asrock board that made such a difference, nor have I had time to try to cripple the Asus to see if I could drag it down to the Asrock's performance with its NUMA settings disabled.

Black-box libraries and tools are a pain here...

It's a fun time to try to make use of all these resources we have available, but it isn't always easy. biggrin.gif
post #383 of 420
Sorry if im posting without searching much,
I have searched google but cant find anything. I recently got this board and a 2650L with an Nvidia gforce 1060
I also added an Asus PCE - AC55BT.

2 issues.
The wifi of the card doesnt show up no matter what pcie slot. Also it doesnt show up in Device manager even after installing the software.

The usb's dont provide enough power for any of my external drives.

It will turn on the bluetooth part of the card if i plug it into one of the very few bluetooth headers on this board but i dont use bluetooth much.

edit: The drive works when i plug it into my laptop and the wifi card was pulled from my old rig (working with the card it was a crosshair v formula (non z) )

Thanks
Mike
post #384 of 420
Quote:
Originally Posted by ang1dust View Post

Sorry if im posting without searching much,
I have searched google but cant find anything. I recently got this board and a 2650L with an Nvidia gforce 1060
I also added an Asus PCE - AC55BT.

2 issues.
The wifi of the card doesnt show up no matter what pcie slot. Also it doesnt show up in Device manager even after installing the software.

The usb's dont provide enough power for any of my external drives.

It will turn on the bluetooth part of the card if i plug it into one of the very few bluetooth headers on this board but i dont use bluetooth much.

edit: The drive works when i plug it into my laptop and the wifi card was pulled from my old rig (working with the card it was a crosshair v formula (non z) )

Thanks
Mike


Hi Mike,

I understand you said WiFi is not detected "no matter what PCIE slot".

To be able to use any available slot, supported CPUs in both sockets are required.

Do you have single CPU build or dual CPU build?

Only slot 2, 3, 4 will work, when socket 1 is occupied.


On USB port, I do not have straight answer for you, unfortunately.

I share some awkward USB issue.

My USB hub and all attached devices are not detected.

After playing with BIOS and installing drivers, they all went fine.

I did not do anything fancy.
post #385 of 420
So today was the day to see if I could fire up the Beast without any errors for the first time. My memory came in several days early and I have the CPUs installed with fans. Nothing stopping me to see what the power button does.

I was a little stressed out making sure I connected everything correctly. Checked everything twice and then went back and checked again. I only install two sticks of memory, one for each 2683 v3 CPU and got the error code sheet out.

Booted it up and no screaming error sound. No two digit code errors. System booted and I installed Windows 7 Ultimate. Nice and smooth running system. I have 56 threads running on this system thumb.gif

I increased the memory to two sticks per CPU and still no errors. I guess, knock on wood, that things are ok. I will run some tests and see how she holds out. I have a GTX 980 GPU on the way this weekend to install.

Fun Fun Fun.


Dwight
post #386 of 420
Your advice was spot on with the PCIe. I had remembered that there was a shared separation but i had just assumed after forgetting which shared which cpu that it was 123 for cpu1 and 456 for cpu2, i tried both 1 and 6. Now its in 2 and it works!

Guess i will play around with the usb. Any hints on what you might have done to fix it?
post #387 of 420
I'm currently running single socket Xeon E5 2690V4 ES QHV5.

I noticed on POST screen, if I put 4 DIMM, ram speed will be shown as (2133), but actually run at 1066.

If I put 8 DIMM, ram speed will be shown as (1866), but still run at 1066.

Any idea?

memtest output (Click to show)
MemTest86 V7.4 Pro Build: 1000
PassMark (R) Software
www.passmark.com

Memory summary:
Number of RAM modules: 8
Total Physical Memory: 130991M

DIMM #: 1
==============
RAM Type: DDR4
Maximum Clock Speed (MHz): 1066 (JEDEC)
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Memory Capacity (MB): 16384
Jedec Manufacture Name: Micron Technology
SPD Revision: 1.0
Registered: Yes
ECC: Yes
DIMM Slot #: 1
Manufactured: Week 30 of Year 2015
Module Part #: 36ASF2G72PZ-2G1A2
Module Revision: 0x0032
Module Serial #: XXXXXXXX
Module Manufacturing Location: 0x0F
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 4
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 9 11 12 13 14 15 16 18 19
Timings @ Max Frequency (JEDEC): 15-15-15-36
Maximum Clock Speed (MHz): 1067
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Minimum Clock Cycle Time, tCK (ns): 0.938
Minimum CAS Latency Time, tAA (ns): 13.500
Minimum RAS to CAS Delay, tRCD (ns): 13.500
Minimum Row Precharge Time, tRP (ns): 13.500
Minimum Active to Precharge Time, tRAS (ns): 33.000
Minimum Row Active to Row Active Delay, tRRD (ns): 3.700
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.500
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR4 Specific SPD Attributes
Maximum Clock Cycle Time, tCKmax (ns): 1.500
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 160.000
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 110.000
Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.700
Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 5.300
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.355
Minimum Four Activate Window Delay (ns): 15.000
Maximum Activate Window in units of tREFI: 8192
Thermal Sensor Present: Yes
DRAM Stepping: 65
DRAM Manufacture: Micron Technology
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair Supported: No
Module Type: RDIMM
Module Height (mm): 31 - 32
Module Thickness (mm): front 1-2 , back 1-2
Reference Raw Card Used: Raw Card B Rev. 17
# of DRAM Rows: 2
# of Registers: 1
Heat Spreader Solution Present: No
Register Manufacturer: IDT
Register Revision: 0x30
Chip Select Drive Strength: Moderate Drive
Command/Address Drive Strength: Strong Drive
ODT Drive Strength: Moderate Drive
CKE Drive Strength: Moderate Drive
Y0,Y2 Drive Strength: Moderate Drive
Y1,Y3 Drive Strength: Moderate Drive

DIMM #: 2
==============
RAM Type: DDR4
Maximum Clock Speed (MHz): 1066 (JEDEC)
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Memory Capacity (MB): 16384
Jedec Manufacture Name: Micron Technology
SPD Revision: 1.0
Registered: Yes
ECC: Yes
DIMM Slot #: 2
Manufactured: Week 32 of Year 2015
Module Part #: 36ASF2G72PZ-2G1A2
Module Revision: 0x0032
Module Serial #: XXXXXXXX
Module Manufacturing Location: 0x0F
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 4
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 9 11 12 13 14 15 16 18 19
Timings @ Max Frequency (JEDEC): 15-15-15-36
Maximum Clock Speed (MHz): 1067
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Minimum Clock Cycle Time, tCK (ns): 0.938
Minimum CAS Latency Time, tAA (ns): 13.500
Minimum RAS to CAS Delay, tRCD (ns): 13.500
Minimum Row Precharge Time, tRP (ns): 13.500
Minimum Active to Precharge Time, tRAS (ns): 33.000
Minimum Row Active to Row Active Delay, tRRD (ns): 3.700
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.500
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR4 Specific SPD Attributes
Maximum Clock Cycle Time, tCKmax (ns): 1.500
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 160.000
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 110.000
Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.700
Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 5.300
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.355
Minimum Four Activate Window Delay (ns): 15.000
Maximum Activate Window in units of tREFI: 8192
Thermal Sensor Present: Yes
DRAM Stepping: 65
DRAM Manufacture: Micron Technology
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair Supported: No
Module Type: RDIMM
Module Height (mm): 31 - 32
Module Thickness (mm): front 1-2 , back 1-2
Reference Raw Card Used: Raw Card B Rev. 17
# of DRAM Rows: 2
# of Registers: 1
Heat Spreader Solution Present: No
Register Manufacturer: IDT
Register Revision: 0x30
Chip Select Drive Strength: Moderate Drive
Command/Address Drive Strength: Strong Drive
ODT Drive Strength: Moderate Drive
CKE Drive Strength: Moderate Drive
Y0,Y2 Drive Strength: Moderate Drive
Y1,Y3 Drive Strength: Moderate Drive

DIMM #: 3
==============
RAM Type: DDR4
Maximum Clock Speed (MHz): 1066 (JEDEC)
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Memory Capacity (MB): 16384
Jedec Manufacture Name: Micron Technology
SPD Revision: 1.0
Registered: Yes
ECC: Yes
DIMM Slot #: 3
Manufactured: Week 30 of Year 2015
Module Part #: 36ASF2G72PZ-2G1A2
Module Revision: 0x0032
Module Serial #: XXXXXXXX
Module Manufacturing Location: 0x0F
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 4
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 9 11 12 13 14 15 16 18 19
Timings @ Max Frequency (JEDEC): 15-15-15-36
Maximum Clock Speed (MHz): 1067
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Minimum Clock Cycle Time, tCK (ns): 0.938
Minimum CAS Latency Time, tAA (ns): 13.500
Minimum RAS to CAS Delay, tRCD (ns): 13.500
Minimum Row Precharge Time, tRP (ns): 13.500
Minimum Active to Precharge Time, tRAS (ns): 33.000
Minimum Row Active to Row Active Delay, tRRD (ns): 3.700
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.500
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR4 Specific SPD Attributes
Maximum Clock Cycle Time, tCKmax (ns): 1.500
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 160.000
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 110.000
Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.700
Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 5.300
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.355
Minimum Four Activate Window Delay (ns): 15.000
Maximum Activate Window in units of tREFI: 8192
Thermal Sensor Present: Yes
DRAM Stepping: 65
DRAM Manufacture: Micron Technology
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair Supported: No
Module Type: RDIMM
Module Height (mm): 31 - 32
Module Thickness (mm): front 1-2 , back 1-2
Reference Raw Card Used: Raw Card B Rev. 17
# of DRAM Rows: 2
# of Registers: 1
Heat Spreader Solution Present: No
Register Manufacturer: IDT
Register Revision: 0x30
Chip Select Drive Strength: Moderate Drive
Command/Address Drive Strength: Strong Drive
ODT Drive Strength: Moderate Drive
CKE Drive Strength: Moderate Drive
Y0,Y2 Drive Strength: Moderate Drive
Y1,Y3 Drive Strength: Moderate Drive

DIMM #: 4
==============
RAM Type: DDR4
Maximum Clock Speed (MHz): 1066 (JEDEC)
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Memory Capacity (MB): 16384
Jedec Manufacture Name: Micron Technology
SPD Revision: 1.0
Registered: Yes
ECC: Yes
DIMM Slot #: 4
Manufactured: Week 32 of Year 2015
Module Part #: 36ASF2G72PZ-2G1A2
Module Revision: 0x0032
Module Serial #: XXXXXXXX
Module Manufacturing Location: 0x0F
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 4
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 9 11 12 13 14 15 16 18 19
Timings @ Max Frequency (JEDEC): 15-15-15-36
Maximum Clock Speed (MHz): 1067
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Minimum Clock Cycle Time, tCK (ns): 0.938
Minimum CAS Latency Time, tAA (ns): 13.500
Minimum RAS to CAS Delay, tRCD (ns): 13.500
Minimum Row Precharge Time, tRP (ns): 13.500
Minimum Active to Precharge Time, tRAS (ns): 33.000
Minimum Row Active to Row Active Delay, tRRD (ns): 3.700
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.500
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR4 Specific SPD Attributes
Maximum Clock Cycle Time, tCKmax (ns): 1.500
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 160.000
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 110.000
Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.700
Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 5.300
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.355
Minimum Four Activate Window Delay (ns): 15.000
Maximum Activate Window in units of tREFI: 8192
Thermal Sensor Present: Yes
DRAM Stepping: 65
DRAM Manufacture: Micron Technology
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair Supported: No
Module Type: RDIMM
Module Height (mm): 31 - 32
Module Thickness (mm): front 1-2 , back 1-2
Reference Raw Card Used: Raw Card B Rev. 17
# of DRAM Rows: 2
# of Registers: 1
Heat Spreader Solution Present: No
Register Manufacturer: IDT
Register Revision: 0x30
Chip Select Drive Strength: Moderate Drive
Command/Address Drive Strength: Strong Drive
ODT Drive Strength: Moderate Drive
CKE Drive Strength: Moderate Drive
Y0,Y2 Drive Strength: Moderate Drive
Y1,Y3 Drive Strength: Moderate Drive

DIMM #: 5
==============
RAM Type: DDR4
Maximum Clock Speed (MHz): 1066 (JEDEC)
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Memory Capacity (MB): 16384
Jedec Manufacture Name: Micron Technology
SPD Revision: 1.0
Registered: Yes
ECC: Yes
DIMM Slot #: 5
Manufactured: Week 30 of Year 2015
Module Part #: 36ASF2G72PZ-2G1A2
Module Revision: 0x0032
Module Serial #: XXXXXXXX
Module Manufacturing Location: 0x0F
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 4
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 9 11 12 13 14 15 16 18 19
Timings @ Max Frequency (JEDEC): 15-15-15-36
Maximum Clock Speed (MHz): 1067
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Minimum Clock Cycle Time, tCK (ns): 0.938
Minimum CAS Latency Time, tAA (ns): 13.500
Minimum RAS to CAS Delay, tRCD (ns): 13.500
Minimum Row Precharge Time, tRP (ns): 13.500
Minimum Active to Precharge Time, tRAS (ns): 33.000
Minimum Row Active to Row Active Delay, tRRD (ns): 3.700
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.500
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR4 Specific SPD Attributes
Maximum Clock Cycle Time, tCKmax (ns): 1.500
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 160.000
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 110.000
Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.700
Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 5.300
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.355
Minimum Four Activate Window Delay (ns): 15.000
Maximum Activate Window in units of tREFI: 8192
Thermal Sensor Present: Yes
DRAM Stepping: 65
DRAM Manufacture: Micron Technology
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair Supported: No
Module Type: RDIMM
Module Height (mm): 31 - 32
Module Thickness (mm): front 1-2 , back 1-2
Reference Raw Card Used: Raw Card B Rev. 17
# of DRAM Rows: 2
# of Registers: 1
Heat Spreader Solution Present: No
Register Manufacturer: IDT
Register Revision: 0x30
Chip Select Drive Strength: Moderate Drive
Command/Address Drive Strength: Strong Drive
ODT Drive Strength: Moderate Drive
CKE Drive Strength: Moderate Drive
Y0,Y2 Drive Strength: Moderate Drive
Y1,Y3 Drive Strength: Moderate Drive

DIMM #: 6
==============
RAM Type: DDR4
Maximum Clock Speed (MHz): 1066 (JEDEC)
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Memory Capacity (MB): 16384
Jedec Manufacture Name: Micron Technology
SPD Revision: 1.0
Registered: Yes
ECC: Yes
DIMM Slot #: 6
Manufactured: Week 32 of Year 2015
Module Part #: 36ASF2G72PZ-2G1A2
Module Revision: 0x0032
Module Serial #: XXXXXXXX
Module Manufacturing Location: 0x0F
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 4
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 9 11 12 13 14 15 16 18 19
Timings @ Max Frequency (JEDEC): 15-15-15-36
Maximum Clock Speed (MHz): 1067
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Minimum Clock Cycle Time, tCK (ns): 0.938
Minimum CAS Latency Time, tAA (ns): 13.500
Minimum RAS to CAS Delay, tRCD (ns): 13.500
Minimum Row Precharge Time, tRP (ns): 13.500
Minimum Active to Precharge Time, tRAS (ns): 33.000
Minimum Row Active to Row Active Delay, tRRD (ns): 3.700
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.500
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR4 Specific SPD Attributes
Maximum Clock Cycle Time, tCKmax (ns): 1.500
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 160.000
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 110.000
Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.700
Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 5.300
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.355
Minimum Four Activate Window Delay (ns): 15.000
Maximum Activate Window in units of tREFI: 8192
Thermal Sensor Present: Yes
DRAM Stepping: 65
DRAM Manufacture: Micron Technology
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair Supported: No
Module Type: RDIMM
Module Height (mm): 31 - 32
Module Thickness (mm): front 1-2 , back 1-2
Reference Raw Card Used: Raw Card B Rev. 17
# of DRAM Rows: 2
# of Registers: 1
Heat Spreader Solution Present: No
Register Manufacturer: IDT
Register Revision: 0x30
Chip Select Drive Strength: Moderate Drive
Command/Address Drive Strength: Strong Drive
ODT Drive Strength: Moderate Drive
CKE Drive Strength: Moderate Drive
Y0,Y2 Drive Strength: Moderate Drive
Y1,Y3 Drive Strength: Moderate Drive

DIMM #: 7
==============
RAM Type: DDR4
Maximum Clock Speed (MHz): 1066 (JEDEC)
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Memory Capacity (MB): 16384
Jedec Manufacture Name: Micron Technology
SPD Revision: 1.0
Registered: Yes
ECC: Yes
DIMM Slot #: 7
Manufactured: Week 30 of Year 2015
Module Part #: 36ASF2G72PZ-2G1A2
Module Revision: 0x0032
Module Serial #: XXXXXXXX
Module Manufacturing Location: 0x0F
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 4
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 9 11 12 13 14 15 16 18 19
Timings @ Max Frequency (JEDEC): 15-15-15-36
Maximum Clock Speed (MHz): 1067
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Minimum Clock Cycle Time, tCK (ns): 0.938
Minimum CAS Latency Time, tAA (ns): 13.500
Minimum RAS to CAS Delay, tRCD (ns): 13.500
Minimum Row Precharge Time, tRP (ns): 13.500
Minimum Active to Precharge Time, tRAS (ns): 33.000
Minimum Row Active to Row Active Delay, tRRD (ns): 3.700
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.500
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR4 Specific SPD Attributes
Maximum Clock Cycle Time, tCKmax (ns): 1.500
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 160.000
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 110.000
Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.700
Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 5.300
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.355
Minimum Four Activate Window Delay (ns): 15.000
Maximum Activate Window in units of tREFI: 8192
Thermal Sensor Present: Yes
DRAM Stepping: 65
DRAM Manufacture: Micron Technology
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair Supported: No
Module Type: RDIMM
Module Height (mm): 31 - 32
Module Thickness (mm): front 1-2 , back 1-2
Reference Raw Card Used: Raw Card B Rev. 17
# of DRAM Rows: 2
# of Registers: 1
Heat Spreader Solution Present: No
Register Manufacturer: IDT
Register Revision: 0x30
Chip Select Drive Strength: Moderate Drive
Command/Address Drive Strength: Strong Drive
ODT Drive Strength: Moderate Drive
CKE Drive Strength: Moderate Drive
Y0,Y2 Drive Strength: Moderate Drive
Y1,Y3 Drive Strength: Moderate Drive

DIMM #: 8
==============
RAM Type: DDR4
Maximum Clock Speed (MHz): 1066 (JEDEC)
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Memory Capacity (MB): 16384
Jedec Manufacture Name: Micron Technology
SPD Revision: 1.0
Registered: Yes
ECC: Yes
DIMM Slot #: 8
Manufactured: Week 32 of Year 2015
Module Part #: 36ASF2G72PZ-2G1A2
Module Revision: 0x0032
Module Serial #: XXXXXXXX
Module Manufacturing Location: 0x0F
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 4
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 9 11 12 13 14 15 16 18 19
Timings @ Max Frequency (JEDEC): 15-15-15-36
Maximum Clock Speed (MHz): 1067
Maximum Transfer Speed (MHz): DDR4-2133
Maximum Bandwidth (MB/s): PC4-17000
Minimum Clock Cycle Time, tCK (ns): 0.938
Minimum CAS Latency Time, tAA (ns): 13.500
Minimum RAS to CAS Delay, tRCD (ns): 13.500
Minimum Row Precharge Time, tRP (ns): 13.500
Minimum Active to Precharge Time, tRAS (ns): 33.000
Minimum Row Active to Row Active Delay, tRRD (ns): 3.700
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.500
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR4 Specific SPD Attributes
Maximum Clock Cycle Time, tCKmax (ns): 1.500
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 160.000
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 110.000
Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.700
Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 5.300
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.355
Minimum Four Activate Window Delay (ns): 15.000
Maximum Activate Window in units of tREFI: 8192
Thermal Sensor Present: Yes
DRAM Stepping: 65
DRAM Manufacture: Micron Technology
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair Supported: No
Module Type: RDIMM
Module Height (mm): 31 - 32
Module Thickness (mm): front 1-2 , back 1-2
Reference Raw Card Used: Raw Card B Rev. 17
# of DRAM Rows: 2
# of Registers: 1
Heat Spreader Solution Present: No
Register Manufacturer: IDT
Register Revision: 0x30
Chip Select Drive Strength: Moderate Drive
Command/Address Drive Strength: Strong Drive
ODT Drive Strength: Moderate Drive
CKE Drive Strength: Moderate Drive
Y0,Y2 Drive Strength: Moderate Drive
Y1,Y3 Drive Strength: Moderate Drive

Edited by StayCool - 10/7/17 at 11:44pm
post #388 of 420
Please put lengthy text output like this between spoiler tags.

I guess your confusion arises from DDR marketing frequency. DDR memory running at 1066MHz is actually DDR-2133. Double Data Rate. So no problem here.
Edit: your wall of text seems to show a configuration with 8 DIMMs running at DDR4-2133. Wher do you get the 1866MHz from?
Edited by amdahl - 10/7/17 at 5:59am
post #389 of 420
Sorry for the lengthy memtest output, how do I do spoiler tags?

The 2133 and 1866 was shown from post screen, for example.

When I put 4 DIMMs, I get 2133.



When I put 8 DIMMs, I get 1866.

post #390 of 420
Quote:
Originally Posted by StayCool View Post

Sorry for the lengthy memtest output, how do I do spoiler tags?

The 2133 and 1866 was shown from post screen, for example.

When I put 4 DIMMs, I get 2133.
Warning: Spoiler! (Click to show)

When I put 8 DIMMs, I get 1866.
Warning: Spoiler! (Click to show)

This is as designed and specified. With RDIMMs, 2 dimms per channel lowers the clock rate. LRDIMMs will allow 2 DIMMs without reducing the clock, but are correspondingly more expensive.
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