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[Various] Intel's new Xeon E5-2602 V4 CPU to sport a whopping 5.1GHz clockspeed and 165W TDP - Page 7

post #61 of 102
Quote:
Originally Posted by Rayleyne View Post

We are approaching the limitations to how small we can make things from sillicon, Which means the next answer to making things go faster instead of packing more transisters is to boost frequency.

or increase IPC, intel needs to start an overhaul.
post #62 of 102
Quote:
Originally Posted by Rayleyne View Post

I don't understand why people find it hard to believe that intel is selling a processor of that frequency, We are approaching the limitations to how small we can make things from sillicon, Which means the next answer to making things go faster instead of packing more transisters is to boost frequency.

That's a negative, Ghost Rider, we need more cores. Source: AMD
post #63 of 102
Quote:
Originally Posted by epic1337 View Post

right, these chips were meant to go in dual-sockets, two of these would easily out-perform the previous generations.

4cores would still be relevant for a long time though, even if software catches up, this would still be relevant.
and by the time software catches up, better chips would be available, one could always upgrade when needed.

2 of these in a dual socket would be an extremely powerful firewall or router.

These will be relevant 3-5 years down the line without a doubt. Especially for smaller scaled infrastructure.
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post #64 of 102
Given the difficulty in getting a Haswell-E to 5.0 GHz, I'm gonna call typo on this one. 4.5GHz binned chips seem reasonable, but 5.1GHz is more than a bit of a stretch, even if they're highly binned...the silicon just has a hard time going that fast.
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post #65 of 102
Quote:
Originally Posted by magnek View Post

Because the thermal density of CPUs is much higher. This is a die map of Haswell CPUs, notice how roughly only 1/3 of the die area is the actual cores? And to make things worse the cores aren't evenly distributed and instead bunched up along one side of the die.

Now compare that to the die map of GK110, where the CUDA cores comprise ~60% of the total die area, so almost twice that of the CPU, and the cores are also much more evenly distributed. (take out a ruler and so some measurements yourself to see I'm not making up these numbers here)

GK110's has a die size of 561 mm^2, 4770K's die size is 177 mm^2. Taking into count the actual die space allocated for the cores, 4770K's core area is ~59 mm^2, while GK110's core area is ~337 mm^2. 4770K's TDP is 84W, GK110's TDP is 250W. If you do the math to figure out the TDP per mm^2 of core area, 4770K's is 1.42W/mm^2, while GK110's is 0.74W/mm^2.

So the 4770K has twice the thermal density compared to GK110, even though the absolute TDP number is much lower. The high thermal density is why CPUs are much harder to cool compared to GPUs.
is this the reason why a 120mm CLC can cool down 980Ti below 50 degrees but a 280mm AiO can't do the same on 4790K ?
post #66 of 102
Quote:
Originally Posted by Klocek001 View Post

is this the reason why a 120mm CLC can cool down 980Ti below 50 degrees but a 280mm AiO can't do the same on 4790K ?

you have to understand one thing, the contact area of the die itself dictates the overall efficiency of the heat transfer.
it does not matter if you put in a 360mm CLC or a 80mm CLC, the die's surface area is still much smaller.
you can actually measure this by taking the water temp and comparing it to the die temp.
if the water isn't hot to begin with then whats there for the rads to cool?


now we've got another issue, if you cram more power on a tinnier chip, of course it'll end up becoming hotter.
CPU dies are much, much more smaller.
i7-4970K = 177mm²
GTX980Ti = 601mm²
Edited by epic1337 - 1/31/16 at 3:43pm
post #67 of 102
Quote:
Originally Posted by epic1337 View Post

you have to understand one thing, the contact area of the die itself dictates the overall efficiency of the heat transfer.
it does not matter if you put in a 360mm CLC or a 80mm CLC, the die's surface area is still much smaller.
you can actually measure this by taking the water temp and comparing it to the die temp.
if the water isn't hot to begin with then whats there for the rads to cool?


now we've got another issue, if you cram more power on a tinnier chip, of course it'll end up becoming hotter.
CPU dies are much, much more smaller.
i7-4970K = 177mm²
GTX980Ti = 601mm²

Haswell-EP (18-core)=662mm2, 5.69billion transistors.
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post #68 of 102
Quote:
Originally Posted by lutjens View Post

Haswell-EP (18-core)=662mm2, 5.69billion transistors.

you realize that hes asking for i7-4790K specifically right?


but yes, HW-EP or generally intel's E7 and most E5 SKUs have a high core count, making them larger than E3 and desktop SKUs.
it also has a lower power density despite the higher power consumption, and the primary reason is it's lower clock.
Edited by epic1337 - 2/1/16 at 1:39pm
post #69 of 102
Quote:
Originally Posted by epic1337 View Post

you realize that hes asking for i7-4790K specifically right?


but yes, HW-EP or generally intel's E7 and most E5 SKUs have a high core count, making them larger than E3 and desktop SKUs.
it also has a lower power density despite the higher power consumption, and the primary reason is it's lower clock.

It was more a statement on how underutilized the 18-core Xeon really is at it's ridiculously low clock speed compared to it's full potential, considering that GPU power dissipation is twice what an 18-core Xeon is for a similar die size.
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post #70 of 102
more or less yeah, at 661mm² so long as they keep the power density below 0.7W per mm² ( <450W TDP ) and it'll remain somewhat cool with the right cooling solution.

BUT, you have to remember these are server chips, if you fit one of that on a U1 or U2 case it'll overheat with a low-profile heatsink.
its like expecting a NH-L9 to cool a 5Ghz i7-4790K, which is very much impossible.




and, these massive core arrays aren't meant for high clocks, most of their usage is on raw compute where clock speed doesn't really matter.
now if you argue that they could just use bigger coolers, or liquid coolers, that beats their intended use in high-density arrays, these chips are used by the dozens on a single rack.
Edited by epic1337 - 2/1/16 at 4:18pm
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