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TIM discussion

post #1 of 7
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I realize that to some extent discussion about various TIM products doesn't loom as important as it once used to, but honestly, even though my 4690K isn't much of an overclocker, it's temps with the CM Hyper 212 EVO are so decent that I'm thinking the Gelid paste is one reason why. And another thing about the Gelid is it seems to function well even after a year's use, compared to AS5.

In the past with my AMD builds (this is my first Intel build in over 15 years), AS5 didn't hold up too well, neither did ASC or Coollabs liquid metal. Yeah, nothing works like Liquid Metal, but I'd swear that the Gelid is the next best thing. Opinions?
WaterWood 1
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WaterWood 1
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post #2 of 7
Eh, I use Thermal Grizzly Kryonaut now. I used to use MX-2 and MX-4 but switched out of it. Kryonaut is pretty expensive though. Never tried GC Extreme though but the original MSRP is $9.99 now it's $15 on Amazon. Might as well buy some Kryonaut.
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post #3 of 7
Forget about what paste is used. As long as it's one of the major brands it's fine. There is only about 3c difference between the extremes of the top 30 TIMs.

Case airflow .. how well your system removes components heated air and supplies them with cool air .. is the biggest factor involved in getting lower temp in 99 out of 100 systems.

Start a thread with a title like "Better Case Airflow or Better TIM?" to see what I mean.

I haven't done a thread like that, but I know by the number of times people post how much their component temps dropped by improving their case airflow .. which is more about how the air flows through the case than large volumes of air flowing through the case. tongue.gif
post #4 of 7
Quote:
Originally Posted by WaterWood View Post

I realize that to some extent discussion about various TIM products doesn't loom as important as it once used to, but honestly, even though my 4690K isn't much of an overclocker, it's temps with the CM Hyper 212 EVO are so decent that I'm thinking the Gelid paste is one reason why. And another thing about the Gelid is it seems to function well even after a year's use, compared to AS5.

In the past with my AMD builds (this is my first Intel build in over 15 years), AS5 didn't hold up too well, neither did ASC or Coollabs liquid metal. Yeah, nothing works like Liquid Metal, but I'd swear that the Gelid is the next best thing. Opinions?

AS5 is a very outdated formula. Most of the dregs of current TIMs are better choices. That said...GC Extreme, Noctua NT-H1, MX-4, Phanteks (included with their coolers, but they really need to sell it separately), etc....really no discernible difference and all top quality. I haven't tried the Thermal Grizzly yet but have been really tempted. Seemingly 10,000 threads later, this answer remains the same.

As @doyll said, improved airflow makes a far bigger difference than changing TIM - provided you are using good TIM in teh first place, and not something as dated as AS5.
post #5 of 7
AS5 came out a dozen years ago. It was the greatest thing since sliced bread when it was introduced, but it's been living off its reputation for several years now. Even the Arctic Silver company's own Ceramique 2, which is cheaper, lasts longer, and is not electrically conductive, is better than AS5.

Any of the big-name modern thermal pastes can do the job. If you want the gold standard, what AS5 was back in the days of the Athlon XP, get some Coollaboratory Liquid Ultra and call it a day.
     
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post #6 of 7
the only TIM that actually matters these days is the one used between the silicon and the IHS smile.gif
post #7 of 7
What phyclum said. thumb.gif

In review after review after review the differences in thermal ability have been proven to make little difference. Tom's Hardware, SkinneeLabs, Overclocking Guide,


Ease of application is much more important than heat transfer of TIM itself. The easier TIM applies and seats, the better and more consistent the TIM print is.

Even the difference in temperatures when too much TIM is used is not a big deal. While 3c is not a lot of difference, the combination of poor seat and lower heat transfer of some TIM can stack up to to 5c .. which is quite a bit.

What is a much bigger deal is how much warmer the air going into your CPU and GPU coolers is compared to the temperature of the room your system is in. In my experience this difference ranges from 2-5c in very well setup and optimized flowing system.

It is very common to see 10-20c warmer component intakes than room when system is working hard. But very few users ever consider this, and if they do their solution is to throw more fans into system. While this often helps, it usually is only a mediocre fix.

As an example you can easily verify, user ciarlanto here, while doing cooler testing for reviews did a series of reviews monitoring cooler intake on his well ventilated Enthoo Luxe test system. The results showed the CPU cooler intake in all testing was 8.8c warmer than room! Remember, this is with GPU only being used to mointor temps and CPU load.. I wonder what the CPU intake temps would have been if GPU was under heavy load dumping 150wats .. or maybe 300watts more hot air inside the case??



Long story short here guys, start worrying about how to optimize case airflow so components are receiving air 2-3c above room temp.
Stop worrying about what less than 2c difference TIM might make.
Worry about the 10-20c hotter the air is going into your cooler.
In almost most new systems there is 5-15c lower CPU temps available by optimizing case airflow.
Many times more than the 2c 'better' TIM might make.


The difference between Coolaboratory Liquid Metal and Arctic Silver 5 2.2c high pressure mount and 1.7c low pressure mount with air cooler. High pressure water cooling it is 1.5c difference.

Edited by doyll - 1/31/16 at 2:33am
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