On the note of stability, I'd argue that if you want to be sure of stability (ex: not just "game stable"), you gotta run the most stringent tests (like Linpak). The reason is because the CPU has got to be able to execute any code it can without error.
I'd argue the following should be the standard
- At least a hour of Intel Burn Test at maximum RAM (most stringent test for cores)
- At least 12 hours of Prime95 LargeFFTs (tests uncore and MCH)
- At least 200% coverage with HCI Memtest (test for RAM stability)
It does make your CPU hot, but if you want assurance of stability, there isn't any other way. x264 and similar tests just don't have the power to really stress the core.
Originally Posted by Just a nickname
I've seen a lot of delidding suggestion. I currently use my 4790k with a Noctua NH-D14. The cpu hasn't seen 80C at 4.9GHz. I might be lucky but keep in mind that the maximal temperature varies with the stress test you are using.
I use LinX and I think it is perfectly fine. I noticed that the voltage needed beyond 4.5-4.6GHz skyrocket.
Here are few reasons why I advice you not to delid:
1- You lose your warranty (duh).
2- CPU loses value on the used market.
3- Lower temperature has virtually no effect on performance. You might be able to get 100-200 extra MHz out of it. I really don't think it is worth losing 1 & 2.
4- You risk to brick the CPU (even if the probability is quite small).
A better cooler is the first thing I would look for.
I would stay away from AIO (all-in-one) liquid coolers. You can get high-end coolers like the Noctua D15 for the same price with similar performance and no risk of having a dead pump or a leaking unit.
My Noctua NH-D14 has been in service since 2009. I seriously doubt a lot of AIO liquid cooler can have such a long life. Sooner or later it will die.
1. It depends on your risk tolerance. I've seen the Delta between delidding and not delidding to be as high as 20-30C on some CPUs (the 4770K in particular tended to run very hot indeed). Devil's Canyon doesn't see as big gains with delidding, but you can still see as much as 10-20C if you delid.
2. Lower resale value from delid is not always true. I have found that often, many used delidded 3770Ks demand a premium on the used market. I think it's because the delidded has assumed the risk of the delidding process, while you as the buyer enjoy the benefits.
3. Lower temperature will yield a couple of hundred Mhz, and may stop throttling. The chips that are on the upper edge - 30C cooler with a delid will probably see quite a big gain. The chips that have been running cool already though won't see as many gains.
4. Agree with this.
You got lucky with your CPU if you can do LinX at 80C at 4.9 GHz. I just wish that Intel would swap over to the solder for the enthusiast series.
Originally Posted by frozenoden
Any wanker might over pay for "muh high end cooler" then slap it in without putting an ounce of thought into what type and how much TIM to use, how the cooler is mounted, the efficiency of the case airflow etc. Sure they get alright temps because the cooler is nice, but my goal is to get that same kind of "nice" cooling with the H212+ just because as many factors as possible have been accounted for and optimized to the best of my ability. And if I go for the overclock, I'd laugh my ass off if I got a stable OC at 4.7 to 5.0GHz with a Hyper 212 cooler, simply because the odds are stacked so high.
Thanks for all the cooling tips so far gentlemen. I should have some good tests to post up soon-ish.
A higher end cooler will still do better than a lower end cooler, all other things being equal. It's a matter of surface area, heatpipes, etc.
The main reason why people delid is because of the glue that Intel uses. It increases the distance from the core to the die, which increases temperatures. While delidding will resolve that, you still want a high end cooler if you want to max out your OC.
Originally Posted by electro2u
Direct die does not gain very much at all. Not like delidding.
Agree. Bear die only gets you a couple of degrees and carries a lot of risk - you can crack the die pretty easily. Delidding gets you a much bigger gain. In some cases, I have heard of people getting higher temps with bare die.
The heatspreader or core is there for a few reasons:
- Spreads out the heat from the die (remember dies have been getting smaller), as the name "heat spreader" implies. That's important as the die gets smaller because the outer heatpipes don't get as much contact.
- Prevents damage from heatsinks, especially as they've gotten bigger and clamping pressure has gone up
- The move to LGA style mounting (needed for the higher pin density) has recessed the die somewhat, so you have to have a heatsink
- It makes it easier to install to, as excessive care is not needed to prevent the die from cracking
It is especially important for the small dies, because a huge heatsink cannot get the heat to the outer dies (one of the reasons why direct contact heatsinks have not done very well compared to the base plate to heatpipe designs).
Originally Posted by Lord Xeb
If that was my chip I would be willing to push it a little more. Toasty, but nothing ti be afraid of. What kills a chip is the voltage, not the heat.
You could probably push to up to 1.35V for 24-7 - maybe stay at 1.3 V to be safe, and keep the VCCIN/VRIN under 2V.Edited by CrazyElf - 2/6/16 at 12:53pm