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[Videocardz]AMD’s “Project F” is 232mm2 discrete GPU made in 14LPP process

post #1 of 99
Thread Starter 
Looks like AMDs upcoming 14nm GPU is a low end like previously speculated.
Only 232mm2.
Quote:
Project F is yet another codename for the chip designed at AMD HQ. What we’ve learned from previous LinkedIn leaks is that just because something is designed and reaches engineering state, it does not mean it will end up as a product for end-users. Project F could be one of such designs.

According to the profile of former AMD employee Project F is a discrete GPU designed in 14nm Low-Power Plus manufacturing process. Such chip would be manufactured by either Samsung or Global Foundaries. 14LPP is a next iteration of 14nm process bringing improvements over 14LPE (Lower-Power Early) process in performance and power efficiency roughly by 15%.



Comparison:
290X: 438mm2
280X: 365mm2
270X: 212mm2


http://videocardz.com/58237/amds-project-f-is-232mm2-discrete-gpu-made-in-14lpp-process
post #2 of 99

Hard to ascertain its performance just based on die surface, but somewhere around a 290 is not a far fetched claim.

   
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post #3 of 99
Yu
Quote:
Originally Posted by Artikbot View Post

Hard to ascertain its performance just based on die surface, but somewhere around a 290 is not a far fetched claim.

Yup.

Depending on how it all scaled down, it could very well be.
    
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post #4 of 99
Quote:
Originally Posted by Artikbot View Post

Hard to ascertain its performance just based on die surface, but somewhere around a 290 is not a far fetched claim.

I need to make a chart of die size vs transistors vs node over time. But I don't think that's unreasonable. Pitcairn and Cayman both had similar transistor counts, at 2.8 and 2.64 billion respectively, and (very) roughly the same performance. Cayman was 389mm2 and Pitcairn was 212mm2. That was from just a single node shrink (and to be fair a very large architectural shift). Here, we're going to see two since 20nm was skipped. Assuming the changes to GCN are big enough, this might end up being around 290X/980/780Ti tier while drawing much less power on a much smaller and hopefully cheaper die. Die size raises costs exponentially, or so I've heard, so smaller and denser is better, especially early on.
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post #5 of 99
Thread Starter 
Quote:
Originally Posted by CynicalUnicorn View Post

I need to make a chart of die size vs transistors vs node over time. But I don't think that's unreasonable. Pitcairn and Cayman both had similar transistor counts, at 2.8 and 2.64 billion respectively, and (very) roughly the same performance. Cayman was 389mm2 and Pitcairn was 212mm2. That was from just a single node shrink (and to be fair a very large architectural shift). Here, we're going to see two since 20nm was skipped. Assuming the changes to GCN are big enough, this might end up being around 290X/980/780Ti tier while drawing much less power on a much smaller and hopefully cheaper die. Die size raises costs exponentially, or so I've heard, so smaller and denser is better, especially early on.

No, 14nm/16nm is physically more or less 20nm
post #6 of 99
It is probably the GPU that AMD was talking about "bringing VR required GPU performance for lower price".

That card is probably like 150-199$ and should be around 290X +-5% levels of performance and consume like 100W~. I have nothing official, but I feel like I am not to far off with my estimations.
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post #7 of 99
Quote:
Originally Posted by iLeakStuff View Post

No, 14nm/16nm is physically more or less 20nm

It really isn't...
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post #8 of 99
232mm^2 wasn't always low-end. The 4870 was certainly high-end when it came out, and it was only 256mm^2.
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post #9 of 99
In terms of raw performance it might as well be on par with a 380 despite being classified as small and "low-end".
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post #10 of 99
Midrage as expected! Probably competing with 290(x) in performance, given die size and node.
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