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High temps after cleaning CLU off of CPU die (delidded 4770K)

post #1 of 25
Thread Starter 
Two years ago I delidded my 4770K and saw roughly a 15C drop as a result. Everything was great!

I used CLU (Coollaboratory Liquid Ultra) between the die and IHS and normal thermal paste for the cooler (NH-D14).

A year or so later the problem started. I decided to make a custom water cooling loop and in the process of rebuilding my system I cleaned off and reapplied all the TIM (using only NT-H1 thermal paste this time). After this I saw a significant increase in temperatures. Considerably worse than before delidding. And this with a water temp that never exceeded 35C. I tried reapplying the paste and reseating the cooling block. When this didn't help I bought a small mounting kit to allow mounting the cooler without the IHS, having the water block make direct contact to the CPU die. This did nothing, the problem persisted.

Though the CPU ran very hot, it did not start throttling under normal use or games and so I ignored it. I'm back on air cooling atm (D15) and because of this temps have gotten a tad worse again. A couple of days ago I saw spikes up to 96C while playing Rocket League. Currently I'm running the CPU at a moderate overclock (1.25v) although the temps aren't much better at stock.

I've tried multiple different methods of applying thermal paste to the die but nothing has resulted in any relevant difference. I've always used Isopropanol for cleaning the die and there is no visible residue on it. Just a glossy reflective surface.

Have anyone experienced something like this? It seems to me that it must be some problem with the contact to the die since not even without the IHS would the CPU stay cool. Is the CLU somehow to blame even tough I can not see any residue?

Any advice would be greatly appreciated. thumb.gif
post #2 of 25
Not familiar with delidding.

But if you reseat the cooler and reapplied TIM correctly, it might be a faulty sensor...

Does your CPU/heatsink/... feel hot (with your hand or infrared meter?)

If it feels ok, it might just be a faulty sensor...
   
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post #3 of 25
Thread Starter 
Quote:
Originally Posted by ASUSfreak View Post

it might just be a faulty sensor...

I've considered that being the case, but it sounds unlikely. I don't know though. Has there been other cases where the CPU sensors starts registering higher temps than before? I'm not familiar with how these sensors work but seeing that I can follow many different readings (core 1, core 2 etc) would that not mean many different sensors would have to be acting up at the same time?

And I'm afraid I haven't got any IR meter.
Edited by SuDDi - 2/26/16 at 10:31am
post #4 of 25
I thought that CLU was considered the best paste to use between the IHS and the Die. Why did you change that?

My thought is that there is still CLU left on the mating surface, and this is causing a bad heat transfer between the die and other parts.
post #5 of 25
Go back to the CLU and IHS ( actually recommend CLP)
post #6 of 25
Thread Starter 
Quote:
Originally Posted by thrasherht View Post

I thought that CLU was considered the best paste to use between the IHS and the Die. Why did you change that?

My thought is that there is still CLU left on the mating surface, and this is causing a bad heat transfer between the die and other parts.

I had used up all the CLU at that point. I don't see that it would benefit you more than a few degrees in any case.

Suppose there is some invisible layer of CLU left on the die, is there anything I could do to remove it? Scrubbing with cloth/paper and isopropanol hasn't done any good.
post #7 of 25
Thread Starter 
Quote:
Originally Posted by electro2u View Post

Go back to the CLU and IHS ( actually recommend CLP)

I'm using the IHS currently, but I fail to see how switching back to CLU/CLP could eliminate whatever the problem is. Having a slightly better or worse TIM should never be able to give this sort of temp difference.

But for lack of other options I might just try it anyway. If only Intel could have made some progress in the soon-to-be 3 years since I bought my CPU I could at least have used this as an excuse to upgrade! wink.gif

no such luck!
Edited by SuDDi - 2/26/16 at 11:36am
post #8 of 25
Quote:
Originally Posted by SuDDi View Post

I'm using the IHS currently, but I fail to see how switching back to CLU/CLP could eliminate whatever the problem is. Having a slightly better or worse TIM should never be able to give this sort of temp difference.

But for lack of other options I might just try it anyway. If only Intel could have made some progress in the soon-to-be 3 years since I bought my CPU I could at least have used this as an excuse to upgrade! wink.gif

no such luck!

Your new TIM is to blame. Normal thermal pastes operate poorly so close to the die. You need to use Kryonaut as the bare minimum, but CLU is still miles ahead.
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post #9 of 25
Well, things got worse with every change you made. Did you change anything else? Take the little fine steel wool thing they give you with the clp and use it on the ihs-clp actually works best with slightly scuffed ihs surface. Ive tried using nt-h1 between die and ihs and had bad results myself. Clu was documented as having pump out problems also. I wonder if maybe the clu residue on the ihs isnt getting good heat transfer with the silicon based thermal paste.

Also, if youve lapped the ihs at all it might not be making even contact. Whats the temp spread between the 4 cores? Direct die is hard to get proper pressure as well. What else can you do but try to go back to the way you had it when temps were better.

The reason the paste between die and ihs is more important is because there is less surface area for heat transfer. The ihs offers larger surface area to transfer to heatplates
Edited by electro2u - 2/26/16 at 11:54am
post #10 of 25
Thread Starter 
Quote:
Originally Posted by Yuhfhrh View Post

Your new TIM is to blame. Normal thermal pastes operate poorly so close to the die. You need to use Kryonaut as the bare minimum, but CLU is still miles ahead.

If that's the case, then how come intel's standard thermal paste did such a good job compared to the NT-H1? Seems to me that I should't get dramatically worse performance than what I had before I delidded.
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