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High temps after cleaning CLU off of CPU die (delidded 4770K) - Page 3

post #21 of 25
Quote:
Originally Posted by Yuhfhrh View Post

I did some more digging, looks like MX-4 is just abnormally bad close to the die. This also shows though that NT-H1 should be performing well for the OP: Warning: Spoiler! (Click to show)

That bit of testing shows a total lack of knowledge of what TIM is designed to do. TIM is supposed to fill microscopic voids between metal to metal contact, not form a layer between the two surfaces. doh.gif

I think Loladinas is right on the mark. thumb.gif
Quote:
Originally Posted by Loladinas View Post

Could it have been the way you applied it? You can't just plop down a blob in the middle, put the IHS on and call it a day. What I did was, warmed up the MX-4 in warm water and painted the die with it thinly, much the same as I did with CLP later on.

That or processor has been pushed too hard and is degrading .. using more power and generating more heat.
Edited by doyll - 2/29/16 at 7:13am
post #22 of 25
Nah, IDC is definitely competent and I trust his testing. I still got the reduction in temps with MX-4, but I did not push it past 1.2V, which may have been a contributing factor.

EDIT: revisited that anandtech thread after I got on my computer at home. Wow, that is a lot of TIM he used.
Edited by Loladinas - 2/29/16 at 8:26am
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Roided midgit
(10 items)
 
Midgit
(12 items)
 
 
CPUMotherboardGraphicsRAM
3770k Asus P8Z77I-Deluxe MSI Radeon RX 480 GAMING X Crucial Ballistix XT 
Hard DriveCoolingCoolingCooling
Crucial M500 Noctua NH-D14 Noctua NF-F12 PWM Noctua NF-F12 PWM 
CoolingCoolingPowerCase
Noctua NF-B9 PWM Noctua NF-B9 PWM Corsair SF600 Fractal Node 304 
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post #23 of 25
LOL, yeah, was the first thing I noticed. biggrin.gif
post #24 of 25
Thread Starter 
So took the CPU out today and scrubbed every surface like crazy with the rough pad thingy that comes with CLU/CLP. I don't think I've used it for cleaning the cpu die previously as I was worried it might damage it, and because the die already looked perfectly clean. After that I used CLP on the die and mounted everything as I normally would

I noted the max temps before and after in Aida64 (default settings) and Intel Burn Test. Stock bios settings and D15 fans at 100%.

Aida64:
Before: 79C
After: 52C

Intel Burn Test
Before: 87C
After: 58C

I'm still not convinced if the extra scrubbing on the die or the CLP made the most difference. I was too lazy to test them separately.

At long last my temps are somewhat normal. Consider the issue resolved! smile.gif
post #25 of 25
BAM.

Yah definitely dont scuff the die!

I am glad your system is running cooler now.
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