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Ethanol filled IHS - Page 2

post #11 of 17
I got a ways better idea. Remove ihs and build a waterblock on the die. Yea die in water i do think they are sealed?

And that would even cool the side of the die
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post #12 of 17
As I recall, most of the soldered IHS chips have a vent hole already in the IHS ... probably to vent flux gases during the soldering process. You could simply inject the liquid through that existing hole and seal it up afterward if you can find a sealant that will handle the vapor pressure when the alcohol gets hot. Perhaps even a very tiny screw with some thread sealant if you get lucky on the hole size. But then you'd have to have a relief divot in your regular heatsink's contact plate.

I can't imagine it making even 1% of a difference though given the large soldered surface of the die versus the surface of the side of the die. Still, an interesting idea.
post #13 of 17
Quote:
Originally Posted by bonami2 View Post

I got a ways better idea. Remove ihs and build a waterblock on the die. Yea die in water i do think they are sealed?

And that would even cool the side of the die

Direct-die cooling (where you have water being sprayed directly at the bare die) has been successful in the past, but I am highly doubtful that it's practical with the thermal density of today's CPUs.
Quote:
Originally Posted by Master Chicken View Post

As I recall, most of the soldered IHS chips have a vent hole already in the IHS ... probably to vent flux gases during the soldering process.

They all have a vent somewhere, even the non-soldered parts. Either a hole in the top of the IHS, or a gap in the adhesive holding the IHS to the substrate.
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post #14 of 17
Subbing as this interests me.
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post #15 of 17
That is a interesting design for heat dissipation, just by doing some quick raw numbers.

Ethanol boils at ~80C,
80C is usually safe temp for most chips.
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post #16 of 17
Ethanol is aggressive to adhesives and will cause the IHS seal to fail and leak.
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post #17 of 17
If you're going to do this, why not use Fluorinert?
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