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post #291 of 383
Is there even a possibility for a 40CU polaris 10

I know some have that expectation just as i did but if the die is that much smaller than the pascal one and there is a big portion of it taken by other things different than the shaders isn't 36CU the max possible?

Comparing the 1080 with 314mm2 16nm FinFET even considering a difference of 9% with the 14nm FinFet LPE the difference is still big
314mm2 vs relative 252mm2

Seems highly unlikely that AMD have managed to fit 40 CU on that much less space.

So the hinted 300$ card is more like the 36CU with OC and better cooling ?
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post #292 of 383
Quote:
Originally Posted by rv8000 View Post


Polaris is to feature a large redesign GCN, it'd be hard to compare it to hawaii, tonga, or fiji based on compute performance alone; it could be worse, it could be better. Also Polaris is 14nm LPP which is much denser than 16nm that Nvidia is using so die size difference isn't as large as you're making it out to be. No one was arguing that AMD probably has a minuscule budget compared to Nvidia.

The important part of the jump to 16/14nm for both AMD and Nvidia was frequency gains, and efficiency gains. I don't think you should neglect how much of a monster GCN would be if it could clock like maxwell, or even marginally close to pascal. People seem to forget how well GCN scales.

 

I think you are missing the fact that AMD's new CGN is much more efficient & streamlined.

 

Odd, that You are basing everything you say off the fact that the new architecture is not advancing, only chip fab.

post #293 of 383
Quote:
Originally Posted by slavovid View Post

Is there even a possibility for a 40CU polaris 10

I know some have that expectation just as i did but if the die is that much smaller than the pascal one and there is a big portion of it taken by other things different than the shaders isn't 36CU the max possible?

Comparing the 1080 with 314mm2 16nm FinFET even considering a difference of 9% with the 14nm FinFet LPE the difference is still big
314mm2 vs relative 252mm2

Seems highly unlikely that AMD have managed to fit 40 CU on that much less space.

So the hinted 300$ card is more like the 36CU with OC and better cooling ?

The full blown card could be $249 G5X 4GB, while $300 is probably a 8GB G5X.


Either way if its 2560 cores its probably as fast as 980 Ti for both 4/8GB variant. Den yes the myth about $300 980 Ti performance is not a myth.


If that is true its insane, just 12 month ago, ppl spent >$1300 just to SLI 980 Ti, and now AMD did that with just $600, or the price of a NON-FEME 1080.
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post #294 of 383
I will not believe a $300 980Ti (stock vs stock) until I see it redface.gif
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post #295 of 383
Quote:
Originally Posted by ChevChelios View Post

I will not believe a $300 980Ti (stock vs stock) until I see it redface.gif


If the 2304 cores already did a 10% above 980, I dont see why a 2560, with 10% more core couldnt do it. The 980 Ti is just 25% faster than 980 anyway.
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post #296 of 383
Quote:
Originally Posted by slavovid View Post


I know some have that expectation just as i did but if the die is that much smaller than the pascal one and there is a big portion of it taken by other things different than the shaders isn't 36CU the max possible?


I forget to mentioned about this. The 290X has 2816 cores pack inside a 438mm sq die.


The 14 LPE has more than 2X the density of 28nm. Scale it down and it means you could pack the same 2816 GCN cores inside a 220m sq die.



2560 not possible to pack inside 232mm sq die, I think you are remotely wrong
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post #297 of 383
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post #298 of 383
Quote:
Originally Posted by guttheslayer View Post

If the 2304 cores already did a 10% above 980, I dont see why a 2560, with 10% more core couldnt do it. The 980 Ti is just 25% faster than 980 anyway.

They didn't, however.
Quote:
Originally Posted by guttheslayer View Post

I forget to mentioned about this. The 290X has 2816 cores pack inside a 438mm sq die.


The 14 LPE has more than 2X the density of 28nm. Scale it down and it means you could pack the same 2816 GCN cores inside a 220m sq die.



2560 not possible to pack inside 232mm sq die, I think you are remotely wrong

1.8X density, if we go by Pascal and iPhone figures. You can pack 2816 cores in P10's die. Just like you can pack almost all 980Ti cores into GP104 die. Does not mean it will happen.
post #299 of 383
Quote:
Originally Posted by guttheslayer View Post


2560 not possible to pack inside 232mm sq die, I think you are remotely wrong

I wasn't stating a fact i was asking a question.
My hopes are indeed for a 40CU P10 that beats 1070 at 300$ price mark smile.gif
But i got a bit worried that it might be impossible.

However i still have to ask something else about your example if there is as lolfail9001 says x1.8 shrink does everything really shrink at that same rate.
But even if not, at least now it seems that the 40CU P10 is still a possibility even if all 2816 cores of a 438mm2 28nm die can't shrink to a 232mm2 14nm LPE then there is high chance that at least 2560 manage to fit smile.gif
Edited by slavovid - 6/1/16 at 6:57am
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post #300 of 383
Let's not forget that Hawaii's 512bit bus uses a lot of diw space.
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