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post #91 of 93
Quote:
Originally Posted by epic1337 View Post

its because the former memory architectures are mostly either floating gate or charge trap.
NAND logic state only started after NOR logic state had been phased out.

this has been the case for more than a decade, thus there wasn't much to differentiate.
now they've been coming up with actual technologies that can replace charge traps or floating gate NAND architectures.
under the patent system, they can bypass them by emphasizing that they aren't a type of NAND architecture, thus patents regarding the other types of architectures surfaced.

But that's not where the divide is. It's between volatile and non-volatile. Intel getting around Sandisk is something else. It looks like the only way Intel got around Sandisks patents is by referencing IBM's patents on 3D memory as similar or sharing, which predate Sandisks patents and makes it difficult for Sandisk to make a violation claim, since they'd have to prove that Intel's patents are more similar to theirs than IBM's which given the similarity of all of them would be impossible.

Have an article that went into detail on the Xpoint patents when they were filed. It includes links to all of them and brief descriptions. Intel even went so far as to show the new memory architecture being sandwiched between the CPU and a layer of DRAM on a Knight's Landing style chip. Along with some other really complicated designs in layered on-chip systems.

http://www.dailytech.com/Exclusive+If+Intel+and+Microns+Xpoint+is+3D+Phase+Change+Memory+Boy+Did+They+Patent+It/article37451.htm
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post #92 of 93
i'm pretty sure there had been a divide with non-volatile and volatile memory ever since DRAM and SRAM was invented.
Edited by epic1337 - 6/2/16 at 2:22pm
post #93 of 93
Quote:
Originally Posted by epic1337 View Post

i'm pretty sure there had been a divide with non-volatile and volatile memory ever since DRAM and SRAM was invented.

Cute, but not what I'm talking about.

I forgot that Sandisk has a stranglehold on patents involving data compression on non-volatile memory. Looks like 3D Xpoint is still tied to Sandisks patent portfolio, and HBM, DiRAM and HMC are not.

HBM is patented in south korea so I can't make heads or tails about what they have or have not licensed as part of their design, and HMC is part of an open industry standard that was started by Micron and Samsung and has been accepted by pretty much the rest of the industry, so no crossing patents there.

So yeah, every Non-volatile 3D memory is tied to Sandisk and has "3D" in the name and every volatile 3D memory does not.

Oh, and this quote from Tezzaron, who makes DiRAM, is also pretty quaint given where the evidence is pointing.
Quote:
We do not believe 3D is a packaging technology … we believe it is an architecture enabler.

http://www.tezzaron.com/about-us/our-technology-101/
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