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Archimedes block install, Cooling upgrade for "Behemoth" - Page 7

post #61 of 125
Thread Starter 
Quote:
Originally Posted by Benjiw View Post

I thought CLU is bad on anything near subzero? and how did you crack dies? Too much or uneven pressure?

No clue how it reacts at crazy phase temps like -45c, but at the "slightly sub zero" temps that TECs operate in they work amazing! They become a solid again at 8c, basically soldering the parts which is great for temps. Dont know how it behaves much under 0c, but id imagine any possible issues due to shrinking or something wont occur until well below that, like sub -20c.

I cracked a naked Winchester 3500+ when remounting a bracket modded XP90...basically we put a spacer between the mount and base which forces it to latch with crazy high pressure. Was popular back in the day but obviously dangerous on naked chips, after a few mounts i either messed up or got unlucky and rig wouldnt boot. When i checked CPU it had the diagonal crack across one corner...still have it somewhere lol!
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post #62 of 125
Quote:
Originally Posted by Puck View Post

No clue how it reacts at crazy phase temps like -45c, but at the "slightly sub zero" temps that TECs operate in they work amazing! They become a solid again at 8c, basically soldering the parts which is great for temps. Dont know how it behaves much under 0c, but id imagine any possible issues due to shrinking or something wont occur until well below that, like sub -20c.

I cracked a naked Winchester 3500+ when remounting a bracket modded XP90...basically we put a spacer between the mount and base which forces it to latch with crazy high pressure. Was popular back in the day but obviously dangerous on naked chips, after a few mounts i either messed up or got unlucky and rig wouldnt boot. When i checked CPU it had the diagonal crack across one corner...still have it somewhere lol!

I thought it freezing would add pressure? As it expands?
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post #63 of 125
Thread Starter 
Quote:
Originally Posted by Benjiw View Post

I thought it freezing would add pressure? As it expands?

It is 100% metal, so it would contract when cooled. No water in it.
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post #64 of 125
Quote:
Originally Posted by Puck View Post

It is 100% metal, so it would contract when cooled. No water in it.

Ah okay didn't think it through properly.
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post #65 of 125
Question for you puck, have you been using CLU/CLP on the TEC hot and cold side for a while or is this the first time? I always thought that because the ceramic insulator on the TEC are made from Aluminium Oxide that it wouldn't be advisable to use CLP/CLU on them for the same reasons you shouldn't use CLU/CLP on aluminium heatsinks/blocks, but admittedly I don't know if that's the case or not. Just checking to see if you can test it on a cheapo ebay TEC before potentially damaging the thermonamic if you haven't used it previously.
post #66 of 125
ok, so I have some CLP that I got for going between my chip and the cover plate over the CPU, but my CPU cover is soldered so there when that idea. tongue.gif
I would like to use this stuff, but I also do not want to make a lot of mistakes with it, so would you mind explaining in detail how it was applied to the TEC's, or the water block copper plate, the amounts used, and yea pic's would be really nice. biggrin.gif
post #67 of 125
there is a video on it's application at coolaboratory website. Also, hold off on applying it to your TEC's, it's very expensive stuff especially when you have 6 TEC's, and waiting to hear if it is safe to use on the aluminium oxide cermamic on TEC's too.

I'd just use it between your waterblock and the CPU, use a very small amount, a small dot on the IHS and brush it out over the IHS evenly

CLP application https://www.youtube.com/watch?v=qFhbqiFh9Us

CLU application https://www.youtube.com/watch?v=3N3D1zaeJoU
Edited by LiamG6 - 7/30/16 at 6:37pm
post #68 of 125
Thread Starter 
Quote:
Originally Posted by LiamG6 View Post

Question for you puck, have you been using CLU/CLP on the TEC hot and cold side for a while or is this the first time? I always thought that because the ceramic insulator on the TEC are made from Aluminium Oxide that it wouldn't be advisable to use CLP/CLU on them for the same reasons you shouldn't use CLU/CLP on aluminium heatsinks/blocks, but admittedly I don't know if that's the case or not. Just checking to see if you can test it on a cheapo ebay TEC before potentially damaging the thermonamic if you haven't used it previously.

I would imagine (hope) that the oxide ceramic layer is enough to protect it. Aluminum Oxide is actually a leftover byproduct of the Gallium+Aluminum reaction so I doubt it would have the same aggressive reaction as aluminum...yes gallium is insane on raw "shiny" aluminum, but I'm hoping it wont be aggressive on a treated AIO ceramic.

At least that's what I was telling myself as I spread it lol biggrin.gif.
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post #69 of 125
well I look forward to the results biggrin.gif needed a guinea pig to test it out thumb.gif
post #70 of 125
Thread Starter 
Based on some more research I am pretty confident that gallium will have zero effect at all on alumina oxide ceramic. A research paper discussing suitable containers for liquid gallium mentions sintered alumina as being a recommended material with low absorption and wetting from the gallium. From what I understand sintered alumina is just heated+pressed alumina, and would just be a less porous version of alumina oxide ceramic. Therefore, it might absorb slightly more of the gallium then the sintered alumina - which is actually a good thing since it was INCREDIBLY difficult to spread already - but should not have any reaction with it. I actually had to apply it directly to the copper plates since it would not spread at all on the TECs themselves no matter how hard I tried to break the surface tension...way more difficult then applying to the CPU die.
Quote:
Considering corrosion, the following materials can be recommended for containers used with liquid gallium: fused quartz and fused silica (up to ~1050 ºC); sintered alumina or sintered BeO (up to ~1000 ºC); tungsten (up to ~810 ºC); graphite (at reducing atmosphere) and beryllium: both up to ~800 ºC; graphite (with steam vapour): up to ~650 ºC; tantalum (up to ~540 ºC); graphite (oxidizing atmosphere): up to ~500 ºC; niobium (up to ~450 ºC); titanium, molybdenum and the austenitic nickel-chromium-based alloy 'Inconel 625': all up to ~ 400 ºC; ferritic stainless steel (SS) AISI type 430 and austenitic SS AISI 347 (or the nearly equivalent ACI CF-8C): both up to ~350 ºC; porcelain (up to ~ 300 ºC), borosilicate glass of low coefficient of expansion (up to ~ 250 ºC); austenitic SS 316 AISI and polytetrafluroethylene (PTFE): both up to ~200 ºC. The temperatures are indicated for the atmospheric pressure, being no more than rather approximate guiding values.

Even not considering quantitative data on adsorption or contact angles, it seems that both graphite and PTFE may be promising container materials while attempting to reduce adsorption and wettability of the liquid gallium to the container surface. Higher adsorption and better wettability can be expected from glass, porcelain, and ceramic oxides.

Edited by Puck - 8/1/16 at 4:06pm
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